Enhanced thermal conductivity of diamond/aluminum composites through tuning diamond particle dispersion
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Diamond/aluminum (Dia/Al) composites were fabricated by powder metallurgy using starting Al powders of different size. Effect of matrix-to-reinforcement particle size ratio (PSR) on diamond particle dispersion was revealed, and higher thermal conductivity of Dia/Al composites with a certain volume fraction was achieved by changing PSR. The results indicated that, with PSR increasing from 0.225 to 0.9, diamond particles tended to show a connecting dispersion and the thermal conductivity of 40 and 50 vol.% Dia/Al composites increased by 21% (from 389 to 472 W/mK) and by 42% (from 442 to 628 W/mK), respectively. The underlying cause was discussed from the point of the coordination number of Al powders around diamond particles. This study supplies a new idea to improve thermal conductivity of Dia/Al composites by tuning particle dispersion for the first time, which is also applicable to other metal matrix composites.
The authors would like to acknowledge the financial support of the National Natural Science Foundation (Nos. 51401123, 51371115, 51671130), the Ministry of Science & Technology of China (No. 2017YFB0406200), the 111 Project (Grant No. B16032), and Shanghai Science & Technology Committee (Nos. 15JC1402100, 17ZR1441500, 14DZ2261200, 14520710100). Dr. Z. Tan thanks to the Project funded by the China Postdoctoral Science Foundation (No. 2014M561469). And all the authors acknowledge the Shanghai Synchrotron Radiation Facility (SSRF) for the analysis of synchrotron radiation CT of the metal matrix composites.
- 1.Zweben C (2008) Advances in photonics thermal management and packaging materials. Proc Soc Photo-Opt Inst 6899:689918–6899181Google Scholar
- 7.Kidalov SV, Shakhov FM (2009) Thermal conductivity of diamond composites. Materials 2:2467–2495Google Scholar
- 28.Li Z, Tan Z, Fan G, Zhang D (2013) Progress of metal matrix composites for efficient thermal management applications. Mater China 32:431–440Google Scholar