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Journal of Materials Science

, Volume 53, Issue 7, pp 5317–5328 | Cite as

Defect structures in solution-grown single crystals of the intermetallic compound Ag3Sn

  • Haibo Yu
  • Yu Sun
  • William R. Meier
  • Paul C. Canfield
  • Christopher R. Weinberger
  • Seok-Woo Lee
  • Mark Aindow
Metals

Abstract

The compound Ag3Sn adopts the ordered orthorhombic D0a Cu3Ti-type structure. It exhibits an unusual low yield stress and high ductility for an intermetallic compound, but the reasons for these effects are not clear. Here, we report an electron microscopy study on the defects present in solution-grown Ag3Sn single crystals that have deformed during the decanting and subsequent handling processes. It is found that the crystals contain two types of lenticular deformation twins: {011}-type and {211}-type. These twins interpenetrate with no evidence of cracking at the intersections. The crystals also contain high densities of dislocations including long straight dipoles with b = ± [010] and shorter curved segments and loops with b = [\( 10\bar{2} \)] and [001]. It is inferred that the dipoles are artifacts of specimen preparation that climb in from the cross-sectional sample surfaces, whereas the shorter segments are deformation debris. If a combination of twinning and dislocation glide of the types observed here were to form concurrently during general deformation of Ag3Sn, then they could provide the necessary number of independent deformation modes to accommodate an arbitrary plastic strain, which might help to explain the unusual ductility of this compound.

Notes

Acknowledgements

This work was supported in part by a research grant from GE Industrial Solutions under a GE-UConn partnership agreement and by the award of a GE Graduate Fellowship to Haibo Yu. Portions of this work were performed using the facilities in the UConn/Thermo Fisher Scientific Center for Advanced Microscopy and Materials Analysis (CAMMA). The sample growth was supported by the US Department of Energy, Office of Basic Energy Sciences, Division of Materials Sciences and Engineering. The growth was performed at the Ames Laboratory. Ames Laboratory is operated for the US Department of Energy by Iowa State University under Contract No. DE-AC02-07CH11358. William Meier is funded by the Gordon and Betty Moore Foundation’s EPiQS Initiative through Grant GBMF4411.

Compliance with ethical standards

Conflict of interest

The authors declare that they have no conflict of interest.

References

  1. 1.
    Suganuma K (2001) Advances in lead-free electronics soldering. Curr Opin Solid State Mater Sci 5:55–64CrossRefGoogle Scholar
  2. 2.
    Flandorfer H, Saeed U, Luef C, Sabbar A, Ipser H (2007) Interfaces in lead-free solder alloys: enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds. Thermochim Acta 459:34–39CrossRefGoogle Scholar
  3. 3.
    Shen J, Chan YC, Liu SY (2008) Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification. Intermetallics 16:1142–1148CrossRefGoogle Scholar
  4. 4.
    Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mater Sci Eng R 27:95–141CrossRefGoogle Scholar
  5. 5.
    Song JM, Lin JJ, Huang CF, Chuang HY (2007) Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties. Mater Sci Eng A 466:9–17CrossRefGoogle Scholar
  6. 6.
    Ochoa F, Williams JJ, Chawla N (2003) Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5 wt.% Ag solder. J Electron Mater 32:1414–1420CrossRefGoogle Scholar
  7. 7.
    Henderson DW, Gosselin T, Sarkhel A, Kang SK, Choi WK, Shih DY, Goldsmith C, Puttlitz KJ (2002) Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys. J Mater Res 17:2775–2778CrossRefGoogle Scholar
  8. 8.
    Chromik RR, Vinci RP, Allen SL, Notis MR (2003) Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints. J Mater Res 18:2251–2261CrossRefGoogle Scholar
  9. 9.
    Deng X, Koopman M, Chawla N, Chawla KK (2004) Young’s modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation. Mater Sci Eng A 364:240–243CrossRefGoogle Scholar
  10. 10.
    Deng X, Chawla N, Chawla KK, Koopman M (2004) Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation. Acta Mater 52:4291–4303CrossRefGoogle Scholar
  11. 11.
    Ghosh G (2004) Elastic properties, hardness, and indentation fracture toughness of intermetallics relevant to electronic packaging. J Mater Res 19:1439–1454CrossRefGoogle Scholar
  12. 12.
    Karakaya I, Thompson WT (1987) The Ag–Sn (silver–tin) system. Bull Alloy Phase Diagr 8:340–347CrossRefGoogle Scholar
  13. 13.
    Yu H, Sun Y, Alpay SP, Aindow M (2016) Solidification microstructures in Ag3Sn–Cu3Sn pseudo-binary alloys. J Mater Sci 51:6474–6487.  https://doi.org/10.1007/s10853-016-9947-y CrossRefGoogle Scholar
  14. 14.
    Fairhurst CW, Cohen JB (1972) The crystal structure of two compounds found in dental amalgam: Ag2Hg3 and Ag3Sn. Acta Crystallogr B28:371–378CrossRefGoogle Scholar
  15. 15.
    Sun Y, Yu H, Kesim MT, Alpay SP, Aindow M (2017) Microstructural stability, defect structures and deformation mechanisms in a Ag3Sn/Cu3Sn alloy. J Mater Sci 52:2944–2956.  https://doi.org/10.1007/s10853-016-0590-4 CrossRefGoogle Scholar
  16. 16.
    Canfield PC (2010) Solution growth of intermetallic single crystals: a beginner’s guide. In: Belin-Ferré E (ed) Properties and applications of complex intermetallics: book series on complex metallic alloys, vol 2. World Scientific, Singapore, pp 93–111CrossRefGoogle Scholar
  17. 17.
    Preston GD (1926) Constitution of the alloys of silver and tin. J Inst Met 35:118Google Scholar
  18. 18.
    Nial O, Almin A, Westgren A (1931) Röntgenanalyse der Systeme Gold–Antimon und Silber–Zinn. Z Phys Chem B14:81–90Google Scholar
  19. 19.
    Umanskij MM (1940) K voprosu o diagramme sostojanij Splava Ag-Sn. Z Phys Chem 14:846–849Google Scholar
  20. 20.
    Ellner M, Mittemeijer EJ (2003) In situ and ex situ investigation of the displacive phase transformations Ag3Sn(h) → Ag3Sn(l) and Ag3Sb(h) → Ag3Sb(l). Z Kristallogr 218:675–682Google Scholar
  21. 21.
    Oehl N, Knipper M, Parisi J, Plaggenborg T, Kolny-Olesiak J (2015) Size-dependent lattice distortion in ε-Ag3Sn alloy nanoparticles. J Phys Chem C 119:14450–14454Google Scholar
  22. 22.
    Rossi PJ, Zotov N, Mittemeijer EJ (2016) Redetermination of the crystal structure of the Ag3Sn intermetallic compound. Z Kristallogr 231:1–9CrossRefGoogle Scholar
  23. 23.
    Burkhardt W, Schubert K (1959) Über messingartige Phasen mit A3-verwandter Struktur. Z Metallkd 50:442–452Google Scholar
  24. 24.
    Canfield PC, Caudle ML, Ho CS, Kreyssig A, Nandi S, Kim MG, Lin X, Kracher A, Dennis KW, McCallum RW, Goldman AI (2010) Solution growth of a binary icosahedral quasicrystal of Sc12Zn88. Phys Rev B 81:020201(R)CrossRefGoogle Scholar
  25. 25.
    Mun E, Ko H, Miller GJ, Samolyuk GD, Bud’ko SL, Canfield PC (2012) Magnetic field effects on transport properties of PtSn4. Phys Rev B 85:035135CrossRefGoogle Scholar
  26. 26.
    Goldman AI, Kong T, Kreyssig A, Jesche A, Ramazanoglu M, Dennis KW, Bud’ko SL, Canfield PC (2013) A family of binary magnetic icosahedral quasicrystals based on rare earths and cadmium. Nat Mater 12:714–718CrossRefGoogle Scholar
  27. 27.
    Canfield PC, Kong T, Kaluarachchi US, Jo NH (2016) Use of frit-disc crucibles for routine and exploratory solution growth of single crystalline samples. Philos Mag 96:84–92CrossRefGoogle Scholar
  28. 28.
    Hirsch PB, Howie A, Nicholson RB, Pashley DW, Whelan MJ (1977) Electron microscopy of thin crystals, 6th edn. Kreiger Publishing Co., New YorkGoogle Scholar
  29. 29.
    Williams DB, Carter CB (2009) Transmission electron microscopy: a textbook for materials science, 2nd edn. Springer, New YorkCrossRefGoogle Scholar
  30. 30.
    Hagihara K, Nakano T, Umakoshi Y (2000) Plastic deformation behavior and operative slip systems in Ni3Nb single crystals. Acta Mater 48:1469–1480CrossRefGoogle Scholar
  31. 31.
    Hagihara K, Nakano T, Umakoshi Y (2001) Deformation twins in Ni3Nb single crystals with D0a structure. In: Schneibel JH, Hanada S, Hemker KJ, Noebe RD, Sauthoff G (eds) High-temperature ordered intermetallic alloys IX. MRS symposium proceedings, MRS, vol. 646, pp N5.23.1–N5.23.6Google Scholar
  32. 32.
    Yoo MH (1981) Slip, twinning, and fracture in hexagonal close packed metals. Met Trans 12A:409–418CrossRefGoogle Scholar
  33. 33.
    Christian JW, Mahajan S (1995) Deformation twinning. Prog Mater Sci 39:1–157CrossRefGoogle Scholar
  34. 34.
    Müllner P, Solnthaler C, Uggowitzer PJ, Speidel MO (1994) Brittle fracture in austenitic steel. Acta Met Mater 42:2111–2217Google Scholar
  35. 35.
    Bieler TR, Fallahi A, Ng BC, Kumar D, Crimp MA, Simkin BA, Zamiri A, Pourboghrat F, Mason DE (2005) Fracture initiation/propagation parameters for duplex TiAl grain boundaries based on twinning, slip, crystal orientation, and boundary misorientation. Intermetallics 13:979–984CrossRefGoogle Scholar
  36. 36.
    Hagihara K, Nakano T, Umakoshi Y (2001) Cyclic deformation behavior of Ni3Nb single crystals deforming by slip on (010)[100]. Intermetallics 9:239–244CrossRefGoogle Scholar
  37. 37.
    Umakoshi Y, Hagihara K, Nakano T (2001) Operative slip systems and anomalous strengthening in Ni3Nb single crystals with the D0a structure. Intermetallics 9:955–961CrossRefGoogle Scholar
  38. 38.
    Ruedl E, Amelinckx S (1969) The substructure of Ni3Mo due to ordering. Mater Res Bull 4:361–368CrossRefGoogle Scholar

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Authors and Affiliations

  1. 1.Department of Materials Science and Engineering, Institute of Materials ScienceUniversity of ConnecticutStorrsUSA
  2. 2.Ames Laboratory and Department of Physics and AstronomyIowa State UniversityAmesUSA
  3. 3.Department of Mechanical Engineering, School of Advanced Materials DiscoveryColorado State UniversityFort CollinsUSA

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