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Journal of Materials Science

, Volume 51, Issue 7, pp 3422–3430 | Cite as

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

  • Jinting JiuEmail author
  • Hao Zhang
  • Shijo Nagao
  • Tohru Sugahara
  • Noriko Kagami
  • Youji Suzuki
  • Yasuyuki Akai
  • Katsuaki Suganuma
Original Paper

Abstract

A new solvent composed of 4-(tert-butyl) cyclohexyl acetate as a dilute agent and HPMDA as a thickener was developed to make micron-sized Ag paste and to bond power semiconductors. The new Ag paste achieved sentinel printing to form sharp Ag patterns with uniform thickness and defined boundaries, which is a key to printing fine pitches in the electronics industry. The electrical resistivity of Ag patterns of 3 μΩ cm was obtained at 280 °C for 30 min. Two Ag-plating copper substrates were successfully bonded with the new Ag paste and the shear strength gradually increased with the bonding temperature. A high strength of 80 MPa was achieved at 280 °C under a small sintering pressure of 0.4 MPa. This value is far higher than the value obtained by using an expensive Ag nanoparticle paste. The detailed mechanism is discussed in this work by comparison with common ethylene glycol solvent.

Keywords

Shear Strength Sinter Behavior Silver Flake Power Semiconductor Device Monobutyl Ether 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

This work was partly supported by the COI Stream Project, and Grant-in-Aid for Scientific Research (Kaken S, 24226017). H. Zhang acknowledges the financial support from China Scholarship Council for his PhD research in Osaka University.

Supplementary material

10853_2015_9659_MOESM1_ESM.docx (70 kb)
Supplementary material 1 (DOCX 69 kb)

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Jinting Jiu
    • 1
    Email author
  • Hao Zhang
    • 1
  • Shijo Nagao
    • 1
  • Tohru Sugahara
    • 1
  • Noriko Kagami
    • 1
  • Youji Suzuki
    • 2
  • Yasuyuki Akai
    • 2
  • Katsuaki Suganuma
    • 1
  1. 1.The Institute of Scientific and Industrial Research (ISIR)Osaka UniversityIbarakiJapan
  2. 2.Daicel CorporationHimejiJapan

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