Journal of Materials Science

, Volume 46, Issue 13, pp 4695–4700 | Cite as

Diffusivity of silver ions in the low temperature co-fired ceramic (LTCC) substrates

  • Chi-Shiung Hsi
  • Yung-Ren Chen
  • Hsing-I HsiangEmail author


Diffusion of silver inner-electrode occurred during sintering of commercial low temperature co-fired glass ceramic substrate made the dielectric surface become light yellow. The samples added with silicon oxide (SiO2) powder, however, maintained white color. Silicon-oxide powder was used to modified the sintering behavior and inhibit the silver ions diffusion for the LTCC ceramics. The alumina particles in the LTCC substrates could be regarded as the diffusion barrier of silver ions. The activation energy for silver ions diffusion in the LTCC substrates was 101 kJ/mol. When 5 wt% SiO2 powder was added into the LTCC substrate, the diffusion activation energy of silver ions became 145 kJ/mol. At sintering temperature of 1180 K, the diffusion coefficient of silver ion in the LTCC ceramic substrates with and without additional SiO2 were 8.88 × 10−13 cm2/s and 1.08 × 10−12 cm2/s, respectively.


Shrinkage Glassy Phase Silver Content Diffusion Activation Energy Green Tape 


  1. 1.
    Thelemann T, Thust H, Hintz M (2002) Microelectron Int 19:19CrossRefGoogle Scholar
  2. 2.
    Dalaney K, Barrett J, Barton J, Doyle R (1999) IEEE Trans Adv Packaging 22:78CrossRefGoogle Scholar
  3. 3.
    Watanabe T, Furutani K, Nakajima N, Mandai H (1999) In: Proceedings of IEEE international microwave symposium, Cambridge, 1999, p 215Google Scholar
  4. 4.
    Tang CW, Chang CY (2002) Electron Lett 38:801CrossRefGoogle Scholar
  5. 5.
    Hsu RT, Jean JH (2005) J Am Ceram Soc 88:2429CrossRefGoogle Scholar
  6. 6.
    Chang JC, Jean JH (2005) J Am Ceram Soc 88:1165CrossRefGoogle Scholar
  7. 7.
    Doty RE, Vajo JJ (1995) In: Proceedings of international society for hybrid microelectronics, Reston, p 465Google Scholar
  8. 8.
    Prudenziti M, Morten B, Gualtieri AF, Leoni M (2004) J Mater Sci Mater Electron 15:447CrossRefGoogle Scholar
  9. 9.
    Naguib HM, Laurin BK (1979) IEEE Trans CHMT 2:196Google Scholar
  10. 10.
    Jean JH, Chang JC (2004) J Am Ceram Soc 87:1287CrossRefGoogle Scholar
  11. 11.
    Shim KB, Cho NT, Lee SW (2000) J Mater Sci 35:813. doi: CrossRefGoogle Scholar
  12. 12.
    Hsi CS, Hsieh FM, Chen HP (2007) J Eur Ceram Soc 27:2779CrossRefGoogle Scholar
  13. 13.
    Waterhouse GIN, Bowmaker GA, Metson JB (2002) Surf Interface Anal 33:401CrossRefGoogle Scholar
  14. 14.
    Waterhouse GIN, Bowmaker GA, Metson JB, Matter S (2001) Phys Chem Chem Phys 3:3838CrossRefGoogle Scholar
  15. 15.
    Shewmon P (1975) In: Diffusion in solids. MacGraw-Hill, New York, 1975 p 12Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2011

Authors and Affiliations

  1. 1.Department of Materials Science and EngineeringNational United UniversityKung-Ching Li, MiaoLiTaiwan
  2. 2.Department of Resources EngineeringNational Cheng Kung UniversityTainanTaiwan

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