Thermal stability and strength of Mo/Pt multilayered films
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Abstract
The strength of Mo/Pt multilayers of varying thicknesses has been investigated using nanoindentation. Metallic composites with individual layer thicknesses ranging from 100 to 20 nm were fabricated. Of specific interest in this study was the strength of the nanocomposites after annealing in air at relatively high temperatures (475 °C) since potential applications involve high temperature and oxidizing environments. Annealing causes significant losses in strength, with the highest losses corresponding to the structures with the thinner Pt layers. Annealing caused grain coarsening as well as loss of the continuous interface between the individual layers when the Pt thickness was less than 35 nm. Oxidation of the Mo layers occurred during annealing, causing an increase in the thickness of the Mo containing layers. The oxidation of Mo occurs in a uniform manner which results in an increase of the total film thickness while the layered structure is maintained. Deconvolution of the Mo 3d spectrum from X-ray Photoelectron Spectroscopy revealed several oxide species, and no Pt–Mo intermetallics were detected. The changes in microstructure are related to the changes in mechanical properties. Films with thinner layer thicknesses were stronger prior to annealing; however, they showed larger losses in strength after the thermal treatment. Structures with thicker Pt layers should be used when the multilayers are exposed to elevated temperatures.
Keywords
Residual Stress MoO3 Annealed Film Bulge Testing Contact DepthNotes
Acknowledgement
This work was supported in part by the US Department of Energy under Grant number DE-FG02-07ER4635.
References
- 1.Misra A, Hirth JP, Kung H (2002) Philos Mag A 82:2935ADSGoogle Scholar
- 2.Was GS, Foecke T (1996) Thin Solid Films 286:1CrossRefADSGoogle Scholar
- 3.Misra A, Kung H (2001) Adv Eng Mater 3:217CrossRefGoogle Scholar
- 4.Misra A, Hirth JP, Hoagland RG (2005) Acta Mater 53:4817CrossRefGoogle Scholar
- 5.Lee HJ, Kwon KW, Ryu C, Sinclair R (1999) Acta Mater 47:3965CrossRefGoogle Scholar
- 6.Misra A, Hoagland RG (2005) J Mater Res 20:2046CrossRefADSGoogle Scholar
- 7.Misra A, Verdier M, Lu YC, Kung H, Mitchell TE, Nastasi M, Embury JD (1998) Scripta Mater 39:555CrossRefGoogle Scholar
- 8.McKeown J, Misra A, Kung H, Hoagland RG, Nastasi M (2002) Scripta Mater 46:593CrossRefGoogle Scholar
- 9.Huang H, Spaepen F (2000) Acta Mater 48:3261CrossRefGoogle Scholar
- 10.Eakins LMR, Olson BW, Richards CD, Richards RF, Bahr DF (2003) Thin Solid Films 441:180CrossRefADSGoogle Scholar
- 11.Morris DJ, Bahr DF, Anderson MJ (2008) Sens Actuators A 141:262CrossRefGoogle Scholar
- 12.Bonnotte E, Delobelle P, Bornier L, Trolard B, Tribillon G (1997) J Mater Res 12:2234CrossRefADSGoogle Scholar
- 13.Vlassak JJ, Nix WD (1992) J Mater Res 7:3242CrossRefADSGoogle Scholar
- 14.Massalski TB (1986) Binary alloy phase diagrams. American Society for Metals, Metals Park, OHGoogle Scholar
- 15.Underwood JH, Gullikson EM, Nguyen K (1993) Appl Opt 32:6985CrossRefADSGoogle Scholar
- 16.Werfel F, Minni E (1983) J Phys C: Solid State Phys 16:6091CrossRefADSGoogle Scholar
- 17.Barr TL (1978) J Phys Chem 82:1801CrossRefGoogle Scholar
- 18.Brox B, Olefjord L (1988) Surf Interface Anal 13:3CrossRefGoogle Scholar
- 19.Jaksic JM, Vracar Lj, Neophytides SG, Zafeiratos S, Papakonstantinou G, Krstajic NV, Jaksic MM (2005) Surf Sci 598:156CrossRefADSGoogle Scholar
- 20.Natesan K, Deevi SC (2000) Intermetallics 8:1147CrossRefGoogle Scholar
- 21.Geng DY, Zhang ZD, Zhang M, Li D, Song XP, Hu KY (2004) Scripta Mater 50:983CrossRefGoogle Scholar
- 22.Gulbransen EA, Andrew KF, Brassart FA (1963) J Electrochem Soc 110:952CrossRefGoogle Scholar
- 23.Misra A, Verdier M, Kung H, Embury JD, Hirth JP (1999) Scripta Mater 41:973CrossRefGoogle Scholar