Journal of Materials Science

, Volume 44, Issue 8, pp 2089–2096 | Cite as

Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple

  • Hongwen HeEmail author
  • Guangchen Xu
  • Fu Guo


Effect of small amount of rare earth (RE) addition on electromigration behavior of Cu/SnBi/Cu solder reaction couple (SRC) was investigated with current density of 5 × 103 A/cm2 at room temperature and 100 °C, respectively. Results indicate that tiny RE addition to eutectic SnBi solder alloy can make the energy of interfaces and grain boundaries decrease, restrain the movement of dislocations and grain boundary sliding. Therefore, phase segregation and IMC growth will be effectively suppressed which enhances the electromigration resistance.


Rare Earth Solder Joint Solder Alloy Solder Ball Solder Matrix 



The authors acknowledge the financial support of this work from the New Century Talent Support Program, Ministry of Education, and the Funding Project PHR (IHLB).


  1. 1.
    Nah JW, Paik KW, Suh JO, Tu KN (2003) J Appl Phys 94:7560CrossRefGoogle Scholar
  2. 2.
    Gan H, Tu KN (2005) J Appl Phys 97:063514-1Google Scholar
  3. 3.
    Lin YH, Hu YC, Tsai CM, Kao CR, Tu KN (2005) Acta Mater 53:2029CrossRefGoogle Scholar
  4. 4.
    Chen C-M, Huang C-C (2007) J Alloy Compd 461:235CrossRefGoogle Scholar
  5. 5.
    Chen C-M, Huang C-C (2008) J Mater Res 23(4):1051CrossRefGoogle Scholar
  6. 6.
    Chen C-M, Huang C-C, Liao C-N et al (2007) J Electron Mater 36(7):760CrossRefGoogle Scholar
  7. 7.
    Wu BY, Chan YC, Zhong HW et al (2007) J Mater Sci 42(17):7415. doi: CrossRefGoogle Scholar
  8. 8.
    Jung K, Conrad H (2004) J Mater Sci 39(5):1803. doi: CrossRefGoogle Scholar
  9. 9.
    Chen ZG (2002) J Electron Mater 31(10):1122CrossRefGoogle Scholar
  10. 10.
    Chen ZG (2003). PhD Thesis, Beijing University of TechnologyGoogle Scholar
  11. 11.
    Hong-Wen HE, Guang-Chen XU, Fu GUO (2007) Electron Compon Mater 26(11):53 (Chinese)Google Scholar
  12. 12.
    Hongwen HE, Guangchen XU, Hu HAO et al (2007) ICEPT, Shanghai, China, pp 225–229Google Scholar
  13. 13.
    Shen J, Liu YC, Gao HX (2007) J Mater Sci 42(14):5375. doi: CrossRefGoogle Scholar
  14. 14.
    El-Rehim AFA (2008) J Mater Sci 43(4):1444. doi: CrossRefGoogle Scholar
  15. 15.
    Cheng F, Nishikawa H, Takemoto T (2008) J Mater Sci 43(10):3643. doi: CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.College of Materials Science and EngineeringBeijing University of TechnologyBeijingChina

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