Advertisement

Journal of Materials Science

, Volume 44, Issue 6, pp 1588–1593 | Cite as

Nanomechanical and surface behavior of polydimethylsiloxane-filled nanoporous anodic alumina

  • Te-Hua Fang
  • Tong Hong Wang
  • Shao-Hui Kang
Article

Abstract

In this article, the mechanical and wetting behavior of anodic aluminum oxide (AAO) and nanoporous-filled AAO were investigated using nanoindentation and contact angle measurements. The results showed that the nanoporous AAO was hydrophobic with a contact angle of 105°. The polymer filling affected the surface property and reduced the contact angle to 84°. The effects of the nanoporous filling on the Young’s modulus and the hardness are investigated and discussed. A three-dimensional finite element model was also successfully developed to understand the nanoindentation-induced mechanism. A maximum von Mises stress of 1058 MPa occurred beneath the indenter.

Keywords

Contact Angle PDMS Anodic Aluminum Oxide Indentation Load Wetting Behavior 

Notes

Acknowledgement

This work was supported in part by the National Science Council of Taiwan under Grant No. NSC95-2221-E150-066.

References

  1. 1.
    Benfield RE, Grandjean D, Kroll M, Pugin R, Sawitowski T, Schmid G (2001) J Phys Chem B 105:1961CrossRefGoogle Scholar
  2. 2.
    Yang H, Rahman S (2003) Nano Lett 3:439CrossRefGoogle Scholar
  3. 3.
    Varghese OK, Gong D, Paulose M, Ong KG, Grimes CA, Dickey EC (2002) J Mater Res 17:1162CrossRefGoogle Scholar
  4. 4.
    Popat KC, Mor G, Grimes CA, Desai TA (2004) Langmuir 20:8035CrossRefGoogle Scholar
  5. 5.
    Ko S, Lee D, Jee S, Park H, Lee K, Hwang W (2006) Thin Solid Films 515:1932CrossRefGoogle Scholar
  6. 6.
    Redon R, Vazquez-Olmos A, Mata-Zamora ME, Ordonez-Medrano A, Rivera-Torres F, Saniger JM (2006) Rev Adv Mater Sci 11:79Google Scholar
  7. 7.
    Fang TH, Chang WJ (2003) Microelectron Eng 65:231CrossRefGoogle Scholar
  8. 8.
    Fang TH, Chang WJ (2006) Appl Surf Sci 252:6243CrossRefGoogle Scholar
  9. 9.
    Wang TH, Fang TH, Lin YC (2007) Appl Phys A 86:335CrossRefGoogle Scholar
  10. 10.
    Grosskreutz JC (1969) J Electrochem Soc 116:1232CrossRefGoogle Scholar
  11. 11.
    Wang TH, Fang TH, Lin YC (2007) Mater Sci Eng A 447:244CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Institute of Mechanical and Electromechanical EngineeringNational Formosa UniversityYunlinTaiwan
  2. 2.Thermal LaboratoryAdvanced Semiconductor Engineering IncKaohsiungTaiwan

Personalised recommendations