Joining of tungsten carbide to nickel by direct diffusion bonding and using a Cu–Zn alloy
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The objective of this work was to study various aspects of liquid and solid state diffusion bonding of cylindrical samples of WC (with 6% Co) and commercially pure nickel (99.5%) produced by direct bonding and brazing using a 25 μm thick 70Cu 30Zn (wt%) alloy as joining element. Joining experiments were carried out on WC/Ni and WC/Cu Zn/Ni combinations at temperature of 980 °C using 1, 15, 25 and 35 min holding times in argon (Ar). The results show that it is possible to create a successful joint at temperature and times used. Joining occurred by the formation of a diffusion zone. The joining interface is feasible because it presents a homogeneous interface with no several interfacial cracking and porosity. In both combinations, it can be observed a diffusion of cobalt decreasing in the direction of the metal, as well as, the diffusion of nickel decreasing in the direction of the ceramic.
KeywordsTungsten Carbide Reaction Layer Joint Strength Diffusion Bonding Diffusion Interface
The authors would like to thank to CONACYT-México and Universidad Michoacana de San Nicolás de Hidalgo (UMSNH) for the financial support and facilities of this research.
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