Microstructure evolution upon annealing of accumulative roll bonding (ARB) 1100 Al sheet materials: evolution of interface microstructures
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The microstructure evolution upon annealing of 1100 aluminum samples that were accumulative roll bonding (ARB) processed were studied with the use of transmission electron microscopy. It was found that the ultra-fine microstructure resulted from the ARB process was not stable. Specifically, a two-stage grain growth behavior was observed, in which a relatively slower rate of grain growth was followed by a more rapid grain growth rate at higher annealing temperature. The bonding interfaces that were unique to the roll bonding process were found to have a significant influence on the grain growth behavior when the grain size of the material was of similar dimension as the bonding interface separation. Discontinuous pockets consisting of smaller grains were found to have formed upon annealing. These pockets represented the remnants of the heavily deformed layer from wire brushing.
KeywordsBonding Interface Boundary Migration Accumulative Roll Bonding Accumulative Roll Bonding Process Faying Surface
The authors would like to acknowledge Dr. Suk-Bong Kang of The Korean Institute of Material Sciences for providing the samples used in this study. This project is funded by Natural Science and Engineering Research Council of Canada (NSERC).
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