Journal of Materials Science

, Volume 40, Issue 12, pp 3267–3269 | Cite as

Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

  • Y. Nakamura
  • T. Ono


Polymer Anelastic Property 
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Copyright information

© Springer Science + Business Media, Inc. 2005

Authors and Affiliations

  1. 1.Department of Mechanical and Systems Engineering, Faculty of EngineeringGifu UniversityGifuJapan

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