Photoresist patterned thick-film piezoelectric elements on silicon
- 116 Downloads
A fundamental limitation of screen printing is the achievable alignment accuracy and resolution. This paper presents details of a thick-resist process that improves both of these factors. The technique involves exposing/developing a thick resist to form the desired pattern and then filling the features with thick film material using a doctor blading process. Registration accuracy comparable with standard photolithographic processes has been achieved resulting in minimum feature sizes of <50 μm and a film thickness of 100 μm. Piezoelectric elements have been successfully poled on a platinised silicon wafer with a measured d 33 value of 60 pCN−1.
KeywordsPZT Doctor blading Thick photoresist
The authors wish to acknowledge the support of Ellison Sensors International Ltd, EPSRC and the Intersect Faraday Partnership. We also thank Morgan Electro Ceramics for the supply of PZT powder.
- 4.N. Harris, M. Koch, S. Beeby, N.M. White, A.G.R. Evans, in Proc. Of the 9th Micromechanics Europe Workshop. (June 1998), p. 78Google Scholar
- 5.E. Huenger, J. Steeper, in Proc. Of Pan Pacific Microelectronics Symposium, 62 (2003)Google Scholar
- 9.R. Torah, S.P. Beeby, N.M. White, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 52, (2005)Google Scholar