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Modeling of modern MOSFETs with strain

  • V. SverdlovEmail author
  • O. Baumgartner
  • T. Windbacher
  • S. Selberherr
Article

Abstract

We review modeling techniques used to compute strain induced performance enhancement of modern MOSFETs. While p-channel MOSFETs were intensively studied, electron transport in strained structures received surprisingly little attention. A rigorous analysis of the subband structure in thin silicon films under stress is performed. Calculated subband effective masses are shown to strongly depend on shear strain and film thickness. A decrease of the transport effective mass under tensile stress in [110] direction and an additional splitting between the unprimed subbands with the same quantum number guarantees a mobility enhancement even in ultra-thin (001) silicon films. This increase of mobility and drive current combined with the improved channel control makes multi-gate MOSFETs based on thin films or silicon fins preeminent candidates for the 22 nm technology node and beyond.

Keywords

MOSFETs modeling Shear strain Two-band k⋅p model for conduction band Valley splitting Mobility and current enhancement 

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Copyright information

© Springer Science+Business Media LLC 2009

Authors and Affiliations

  • V. Sverdlov
    • 1
    Email author
  • O. Baumgartner
    • 1
  • T. Windbacher
    • 1
  • S. Selberherr
    • 1
  1. 1.Institute for MicroelectronicsTU WienViennaAustria

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