Journal of Applied Electrochemistry

, Volume 38, Issue 10, pp 1347–1356 | Cite as

Investigation of dissolution inhibitors for electrochemical mechanical planarization of copper using beta-alanine as a complexing agent

  • B. K. Klug
  • C. M. Pettit
  • S. Pandija
  • S. V. Babu
  • D. Roy
Original Paper
First Online:
Received:
Revised:
Accepted:

Abstract

Dissolution inhibition capabilities of benzotriazole (BTAH) and ammonium dodecyl sulfate (ADS) are investigated, in combination with β-alanine, as a complexing agent for applications in electrochemical mechanical planarization (ECMP) of copper. Cu electrodissolution is induced by linear sweep voltammetry (LSV), and Fourier transform electrochemical impedance spectroscopy (FT-EIS) is combined with LSV to examine the relative roles of the electrolyte additives in governing the surface reactions of Cu under voltage activated conditions of ECMP. The experiments focus on the electrochemical rather than mechanical component of ECMP, and are designed to probe both the individual and combined effects of BTAH and ADS on Cu electro-dissolution in the absence of abrasion.

Keywords

Beta-alanine Copper CMP ECMP Impedance spectroscopy Surfactant 
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Notes

Acknowledgement

We thank the School of Arts and Sciences of Clarkson University for financial support for this work, and Mr. Jianping Zheng for technical assistance.

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Copyright information

© Springer Science+Business Media B.V. 2008

Authors and Affiliations

  • B. K. Klug
    • 1
  • C. M. Pettit
    • 2
  • S. Pandija
    • 3
  • S. V. Babu
    • 3
  • D. Roy
    • 1
  1. 1.Department of PhysicsClarkson UniversityPotsdamUSA
  2. 2.Department of PhysicsEmporia State UniversityEmporiaUSA
  3. 3.Center for Advanced Materials Processing, Clarkson UniversityPotsdamUSA

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