Journal of Applied Electrochemistry

, Volume 38, Issue 4, pp 531–536 | Cite as

Copper plating on titanium alloy 6-2-4-2 using an in situ high voltage pulse followed by plate-up

  • R. J. von Gutfeld
  • Alan C. West
Original Paper


We have used an in situ technique that removes the oxide from the surface of the alloy titanium 6-2-4-2, followed by copper electroplating of the surface. The oxide removal is accomplished by means of a short voltage pulse from a discharging capacitor between the cathode (titanium) and anode while submerged in the plating solution. Within seconds thereafter, the electrodes are switched to a separate power supply for electroplating copper onto the titanium. From the experimental data, we believe that the oxide is removed by means of dielectric breakdown mechanisms giving rise to a statistical probability that all of the surface oxide is removed. When this occurs, we obtain adherent depositions based on standard tape testing of the deposit. We determine a set of voltage and energy density conditions which are most likely to result in good adhesion. Scanning electron micrographs of adherent copper deposits are presented.


Titanium Electroplating In situ Oxides Breakdown Copper 



We are pleased to acknowledge experimental help from Joseph Woo and are grateful for the titanium 6-2-4-2 samples provided us by Tyco Electronics Division, Harrisburg, PA.


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Copyright information

© Springer Science+Business Media B.V. 2007

Authors and Affiliations

  1. 1.Department of Chemical EngineeringColumbia UniversityNew YorkUSA

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