Copper plating on titanium alloy 6-2-4-2 using an in situ high voltage pulse followed by plate-up
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We have used an in situ technique that removes the oxide from the surface of the alloy titanium 6-2-4-2, followed by copper electroplating of the surface. The oxide removal is accomplished by means of a short voltage pulse from a discharging capacitor between the cathode (titanium) and anode while submerged in the plating solution. Within seconds thereafter, the electrodes are switched to a separate power supply for electroplating copper onto the titanium. From the experimental data, we believe that the oxide is removed by means of dielectric breakdown mechanisms giving rise to a statistical probability that all of the surface oxide is removed. When this occurs, we obtain adherent depositions based on standard tape testing of the deposit. We determine a set of voltage and energy density conditions which are most likely to result in good adhesion. Scanning electron micrographs of adherent copper deposits are presented.
KeywordsTitanium Electroplating In situ Oxides Breakdown Copper
We are pleased to acknowledge experimental help from Joseph Woo and are grateful for the titanium 6-2-4-2 samples provided us by Tyco Electronics Division, Harrisburg, PA.
- 1.von Gutfeld RJ, West AC (2007) J Vac Sci Technol A 25(2):319; (see also von Gutfeld RJ, West AC in PCT patent application, WO 2006/086407, ‘In situ plating and etching of materials covered with a surface film’ August 17, 2006)Google Scholar