Inorganic Materials

, Volume 41, Issue 1, pp 19–23 | Cite as

Mechanism of copper chemical vapor deposition from copper dipivaloylmethanate in hydrogen

  • V. V. Bakovets
  • T. M. Levashova
  • I. P. Dolgovesova
  • E. A. Maksimovskii


The kinetics and mechanism of catalyzed copper deposition via hydrogen reduction of copper(II) dipivaloylmethanate are studied between 200 and 350°C. A multistep mechanism is proposed which involves the formation of a polychelate on the surface of the growing Cu film. Film growth is accompanied by the transfer of the organic ligand of the polychelate to the adsorbed products of Cu(dpm)2 dissociation. The low activation energy of the process is interpreted in terms of formal kinetics. The introduction of H(dpm) further reduces the activation energy of the process, to 10±5 kJ/mol, owing to the dissociative adsorption of the diketone.


Hydrogen Copper Activation Energy Inorganic Chemistry Chemical Vapor Deposition 
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Copyright information

© MAIK “Nauka/Interperiodica” 2005

Authors and Affiliations

  • V. V. Bakovets
    • 1
  • T. M. Levashova
    • 1
  • I. P. Dolgovesova
    • 1
  • E. A. Maksimovskii
    • 1
  1. 1.Nikolaev Institute of Inorganic Chemistry, Siberian DivisionRussian Academy of SciencesNovosibirskRussia

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