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Influence of Thermal Contact Resistance on Thermal Conductivity Measurement with a High-Temperature Guarded Hot Plate Apparatus

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Abstract

A high-temperature guarded hot plate (GHP) apparatus was developed by the Shandong Nonmetallic Materials Institute for the thermal conductivity of insulations. To investigate the influence of the thermal contact resistance of this apparatus under high-temperature test condition on the measurement results, the mullite specimen was measured under different pressures and temperatures before and after the surface treatment. The result indicated that the influence of thermal contact resistance on measurement results was remarkable only under the low-pressure, low-temperature condition with the surface untreated, and could be ignored under routine testing condition. To further confirm this conclusion, the specimen was ground to different thicknesses and then measured with a pressure 2.0 kPa at different temperatures. The measurement results showed that the thermal contact resistance of this high-temperature GHP apparatus was assumed to be sufficiently small at this pressure, especially at higher temperature.

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Acknowledgement

This study was supported by State Administration for Science, Technology and Industry for National Defense (CN) (Grant Number JSJC2013208C035).

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Correspondence to Kai Yao.

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Yao, K., Liu, Y., Zhou, Y. et al. Influence of Thermal Contact Resistance on Thermal Conductivity Measurement with a High-Temperature Guarded Hot Plate Apparatus. Int J Thermophys 41, 18 (2020) doi:10.1007/s10765-019-2595-0

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Keywords

  • Guarded hot plate method
  • Thermal conductivity
  • Thermal contact resistance