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Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

  • R. Hernández
  • J. A. Barrientos Zaragoza
  • J. L. Jiménez-PérezEmail author
  • A. Cruz Orea
  • Z. N. Correa-Pacheco
Asian Thermophysical Properties Conference Paper
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  1. Asian Thermophysical Properties Conference Papers

Abstract

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV–visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

Keywords

Curing film Dry film Photoacoustic Printed circuit board UV laser 

Notes

Acknowledgements

Thanks to CONACYT, COFAA and CGPI-IPN, México, for their partial financial support. One of the authors (A. Cruz-Orea) is grateful for the financial support of CONACYT through Project 241330. Also, we thank Ing. Esther Ayala at the Physics Department of CINVESTAV-IPN for her technical support.

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Copyright information

© Springer Science+Business Media New York 2017

Authors and Affiliations

  • R. Hernández
    • 1
  • J. A. Barrientos Zaragoza
    • 1
  • J. L. Jiménez-Pérez
    • 1
    Email author
  • A. Cruz Orea
    • 2
  • Z. N. Correa-Pacheco
    • 3
  1. 1.UPIITA, Instituto Politécnico NacionalCiudad de MéxicoMexico
  2. 2.Departamento de FísicaCINVESTAV-IPNCiudad de MéxicoMexico
  3. 3.CEPROBI, Instituto Politécnico NacionalYautepecMexico

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