International Journal of Fracture

, Volume 167, Issue 2, pp 183–193 | Cite as

Melting and crack growth in electrical conductors subjected to short-duration current pulses

  • F. Gallo
  • S. Satapathy
  • K. Ravi-ChandarEmail author
Original Paper


In this paper, we examine the response of a crack tip in an electrically conducting material subjected to a combination of mechanical load as well as a high density electrical current. We present a detailed examination of the process of evolution of melting and ejection, as revealed by high speed photography. The critical mechanical and electrical parameters that govern crack extension are then determined for two different alloys. Finally, we present an evaluation of the phenomenon through a coupled field simulation to examine the nature of the interaction between the electric field and the thermo-mechanical response.


Joule heating Current intensity factor Electromechanical interaction 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Supplementary material

ESM 1 (MPG 23032 kb)


  1. Doelp GGS (1984) Experimental and numerical analysis of electric currents and electromagnetic blunting of cracks in thin plates. MS Thesis, Cornell UniversityGoogle Scholar
  2. Finkel VM, Golovin YI, Sletkov AA (1977) Disintegration of a crack tip with a stron electromagnetic field. Sov Phys Doklady 22: 683–685Google Scholar
  3. Gallo F, Satapathy S, Ravi-Chandar K (2009) Melting and cavity growth in the vicinity of crack tips subjected to short-duration current pulses. IEEE Trans Magn 45: 584–586CrossRefGoogle Scholar
  4. Landis CM (2004) Energetically consistent boundary conditions for electromechanical fracture. Int J Solids Struct 41: 6291–6315CrossRefGoogle Scholar
  5. Mukherjee S, Morjaria MA, Moon FC (1982) Eddy current flows around cracks in thin plates for nondestructive testing. J Appl Mech 49: 389–392CrossRefGoogle Scholar
  6. Satapathy S, Stefani F, Saenz A (2005) Crack tip behavior under pulsed electromagnetic loading. IEEE Trans Magn 41: 226–230CrossRefGoogle Scholar
  7. Simmons RO, Baluffi RW (1959) Measurements of the high-temperature electrical resistance of aluminum: resistivity of lattice vacancies. Phys Rev 117: 62–68CrossRefGoogle Scholar
  8. Tada H, Paris PC, Irwin GR (1973) The handbook of stress intensity factors. Del Research Corporation, Hellertown, PAGoogle Scholar
  9. Tucker TJ, Toth RP (1975) EBW1: A computer code for the prediction of the behavior of electrical circuits containing exploding wire elements, Sandia National Laboratories Report # SAND-75-0041Google Scholar
  10. Zhang TY, Wang T, Zhao M (2003) Failure behavior and failure criterion of conductive cracks (deep notches) in thermally depoled PZT-4 ceramics. Acta Materialia 51: 4881–4895CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media B.V. 2010

Authors and Affiliations

  1. 1.Department of Aerospace Engineering and Engineering MechanicsThe University of Texas at AustinAustinUSA
  2. 2.Institute for Advanced TechnologyThe University of Texas at AustinAustinUSA

Personalised recommendations