Advertisement

International Journal of Fracture

, Volume 162, Issue 1–2, pp 77–90 | Cite as

Dynamic delamination of patterned thin films: a numerical study

  • Phuong Tran
  • Soma Sekhar V. Kandula
  • Philippe H. Geubelle
  • Nancy R. Sottos
Original Paper

Abstract

We present an analytical investigation of a test protocol recently developed to extract the fracture toughness of thin films used in microelectronics and other engineering applications. The testing method involves the dynamic delamination of patterned thin films initiated by a laser-induced pressure pulse applied on the backside of the substrate. The kinetic energy imparted by the pulse to a weakly bonded (pre-cracked) region of the film is converted into fracture energy as the thin film delaminates in a controlled fashion over multiple milimeters. To support these experiments and extract the interface fracture toughness values, we develop a numerical scheme based on the combination of a nonlinear beam model used to capture the elastodynamic response of the thin film and a cohesive failure model to simulate the spontaneous propagation of the delamination front. The accuracy of the beam model is assessed through a comparison with the results of a more complex 2D hybrid spectral/finite element scheme. Numerical results are compared with experimental measurements of the delamination length and the outcome of a parametric study of some of the key geometrical and loading quantities defining the delamination event is presented.

Keywords

Thin film Fracture toughness Delamination Dynamic fracture Laser spallation Beam model Cohesive model 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Belytschko T, Glaum LW (1979) Applications of higher order corotational stretch theories to nonlinear finite element analysis. Comput Struct 10: 175–182zbMATHCrossRefGoogle Scholar
  2. Bjerke TW, Lambros J (2003) Theoretical development and experimental validation of a thermally dissipative cohesive zone model for dynamic fracture of amorphous polymers. J Mech Phys Solids 51: 1147–1170CrossRefADSGoogle Scholar
  3. Borhan H, Amandian MD (2006) Dynamic modeling of geometrically nonlinear electrostatically actuated microbeams: Corotational finite element formulation and analysis. J Phys Conf Ser 34: 606–613CrossRefADSGoogle Scholar
  4. Breitenfeld MS, Geubelle PH (1998) Numerical analysis of dynamic debonding under 2D in-plane and 3D loading. Int J Fract 93: 13–38CrossRefGoogle Scholar
  5. Cook RD, Malkus DS, Plesha ME, Witt RJ (2001) Concepts and applications of finite element analysis. Wiley, New YorkGoogle Scholar
  6. Crisfield MA, Cole G (1989) Co-rotational beam elements for two- and three-dimensional non-linear analysis. Proc IUTAM/IACM Symp Discret Methods Struct Mech 4: 115–124Google Scholar
  7. Drory M, Hutchinson JW (1996) Measurement of the adhesion of a brittle film on a ductile substrate by indentation. Proc R Soc A Math Phys Eng Sci 452: 2319–2341CrossRefADSGoogle Scholar
  8. Freund LB, Suresh S (2003) Thin film materials: stress, defect formation and surface evolution. Cambridge University Press, CambridgeGoogle Scholar
  9. Geubelle PH, Breitenfeld MS (1997) Numerical analysis of dynamic debonding under anti-plane shear loading. Int J Fract 85: 265–282CrossRefGoogle Scholar
  10. Gupta V, Yuan J (1993) Measurement of interface strength by the modified laser-spallation technique: II. Applications to metal/ceramic interfaces. J Appl Phys 74: 2397–2404CrossRefADSGoogle Scholar
  11. Gupta V, Argon AS, Cornie JA, Parks DM (1990) Measurement of interface strength by laser pulse-induced spallation. Mater Sci Eng 125: 105–117Google Scholar
  12. Gupta V, Argon AS, Parks DM, Cornie JA (1992) Measurement of interface strength by a laser spallation technique. J Mech Phys Solids 40: 141–180CrossRefADSGoogle Scholar
  13. Gupta V, Yuan J, Pronin AN (1994) Recent development in the laser spallation technique to measure the interface strength and its relationship to interface toughness with applications to metal/ceramic, ceramic/ceramic and ceramic/polymer interfaces. J Adhes Sci Technol 8: 713–747CrossRefGoogle Scholar
  14. Hendrickx J, Geubelle PH, Sottos NR (2005) A spectral scheme to simulate the mode III dynamic delamination of thin films. Eng Fract Mech 72: 1866–1891CrossRefGoogle Scholar
  15. Hu L, Wang J (2006) Pure-shear failure of thin films by laser-induced stress waves. Exp Mech 46: 637–645CrossRefMathSciNetGoogle Scholar
  16. Hughes TJR (1987) Linear static and dynamic finite element analysis. Prentice-Hall, Englewood CliffszbMATHGoogle Scholar
  17. Kandula S (2008) Delamination of thin film patterns using laser-induced stress wave, Ph.D. thesis, University of IllinoisGoogle Scholar
  18. Kandula S, Hartfield CD, Geubelle PH (2008a) Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique. Thin Solid Films 516: 7627–7635CrossRefADSGoogle Scholar
  19. Kandula S, Tran P, Geubelle PH, Sottos NR (2008b) Dynamic delamination of patterned thin films. Appl Phys Lett 93: 261902-1-3CrossRefADSGoogle Scholar
  20. Kimberly J, Chasiotis I, Lambros J (2008) Failure of microelectromechanical systems subjected to impulse loads. Int J Solids Struct 45: 497–512CrossRefGoogle Scholar
  21. Kitey R, Geubelle P, Sottos N (2009) Mixed-mode interfacial adhesive strength of a thin film on an anisotropic substrate. J Mech Phys Solids 57: 51–64CrossRefADSGoogle Scholar
  22. Liang Y, Bi X, Wang J (2008) Numerical simulation of laser-induced thin film delamination. Thin Solid Films 516: 971–981CrossRefADSGoogle Scholar
  23. Mittal KL (1987) Selected biliography on adhesion measurement of films and coatings. J Adhes Sci Technol 1(3): 247–259CrossRefGoogle Scholar
  24. Ortiz M, Pandolfi A (1999) Finite-deformation irreversible cohesive elements for three-dimensional crack-propagation analysis. Int J Numer Methods Eng 44: 1267–1282zbMATHCrossRefGoogle Scholar
  25. Pronin AN, Gupta V (1997) Measurement of thin film interface toughness by using laser-generated stress pulses. J Mech Phys Solids 46: 389–410CrossRefADSGoogle Scholar
  26. Thouless MD (1994) Fracture mechanics for thin film adhesion. IBM J Res Dev 38: 367–377CrossRefGoogle Scholar
  27. Tran P, Kandula S, Geubelle P, Sottos N (2008) Hybrid spectral/finite element analysis of dynamic delamination of patterned thin films. Eng Fract Mech 75: 4217–4233CrossRefGoogle Scholar
  28. Vossen JL (1978) Measurements of film-substrate bond strength by laser spallation. Adhesion measurement of thin films, thick films and bulk coatings. Am Soc Test Mater 640: 122–123Google Scholar
  29. Wang J (2002) Thin film adhesion measurement by laser induced stress waves, Ph.D. thesis, University of IllinoisGoogle Scholar
  30. Wang J, Weaver RL, Sottos NR (2002) A parametric study of laser induced thin film spallation. Exp Mech 42: 74–83CrossRefGoogle Scholar
  31. Wang J, Weaver RL, Sottos NR (2004) Tensile and mixed-mode strength of a thin film substrate interface under laser induced pulsed loading. J Mech Phys Solids 52: 999–1022CrossRefADSGoogle Scholar
  32. Zhang Z, Zhao Y (2006) An effective method of determining the residual stress gradients in a micro-cantilever. Microsyst Technol 12: 357–364CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media B.V. 2010

Authors and Affiliations

  • Phuong Tran
    • 1
  • Soma Sekhar V. Kandula
    • 2
    • 4
  • Philippe H. Geubelle
    • 2
  • Nancy R. Sottos
    • 3
  1. 1.Department of Mechanical Science and EngineeringUniversity of IllinoisUrbanaUSA
  2. 2.Department of Aerospace EngineeringUniversity of IllinoisUrbanaUSA
  3. 3.Department of Materials Science and EngineeringUniversity of IllinoisUrbanaUSA
  4. 4.Intel CorporationPhoenixUSA

Personalised recommendations