Catalysis Letters

, Volume 147, Issue 12, pp 2962–2966 | Cite as

Enhanced Cycle Performance of Silicon-Based Anode by Annealing Cu-Coated Carbon Cloth Current Collector for Flexible Lithium-Ion Battery

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Abstract

Cu-coated carbon cloth (Cu/CC) fabrics with protuberance surface have been prepared in the work and evaluated as anode current collectors in Li-ion batteries. Firstly, the copper layers are formed on the carbon cloth surface by electrodepositing method. After annealing at 400 °C, hole and protuberance structure appears within the copper layers. Finally the electrodes are fabricated by annealed Cu/CC fabrics and silicon as current collectors and anode active materials for Li-ion batteries. The electrochemical properties of silicon cells with bare copper and copper layers coated current collectors are investigated. The initial discharge capacities are 1250 mAh/g at current density of 210 mA/g (0.05 C, C = 4200 mA/g). The batteries have good cycle performance and the capacities still remain 98% (compare with initial capacities) after 40 cycles. The good cycle performance of Cu/CC anodes are attributes to the particular morphology of copper layers. The expansion space of silicon materials can be buffered by protuberance structure during cycles. In addition, the Cu/CC electrode have good electrical conductivity and flexibility, which are expected to be used in flexible batteries and silicon based Li-ion batteries.

Graphical Abstract

Keywords

Cycle performance Silicon-based anode material Annealing Cu-coated carbon cloth Current collector Flexible lithium ion battery 

Notes

Acknowledgements

The authors express their gratitude for the Natural Sciences and Science & Technology Foundation for Selected overseas Chinese scholar of Tianjin for financial support to actualize this project. Tianjin University of Technology provides a postgraduate scholarship.

Compliance with Ethical Standards

Conflict of interest

Authors declare no existing conflict of interest.

References

  1. 1.
    Zhang W, Chen X, Yong T et al (2016) Multiwalled carbon nanotube webs welded with Si nanoparticles as high-performance anode for lithium-ion batteries. J Alloys Compd 688:216–224CrossRefGoogle Scholar
  2. 2.
    Zhang J, Zhang C, Wu S et al (2016) High-performance lithium-ion battery with nano-porous polycrystalline silicon particles as anode. Electrochim Acta 208:174–179CrossRefGoogle Scholar
  3. 3.
    Hoeltgen C, Lee JE, Jang BY (2016) Stepwise carbon growth on Si/SiOx core-shell nanoparticles and its effects on the microstructures and electrochemical properties for high-performance lithium-ion battery’s anode. Electrochim Acta 222:535–542CrossRefGoogle Scholar
  4. 4.
    Li C, Shi T, Yoshitake H et al (2017) A flexible high-energy lithium-ion battery with a carbon black-sandwiched Si anode. Electrochim Acta 225:11–18CrossRefGoogle Scholar
  5. 5.
    Shin NR, Kang YM, Song MS et al (2009) Effects of Cu substrate morphology and phase control on electrochemical performance of Sn-Ni alloys for Li-ion battery. J Power Sources 186(1):201–205CrossRefGoogle Scholar
  6. 6.
    Tang X, Wei L, Ye B et al (2013) Preparation of current collector with blind holes and enhanced cycle performance of silicon-based anode. Trans Nonferrous Met Soc China 23(6):1723–1727CrossRefGoogle Scholar
  7. 7.
    Cheng S, Shi T, Tao X et al (2016) In-situ oxidized copper-based hybrid film on carbon cloth as flexible anode for high performance lithium-ion batteries. Electrochim Acta 212:492–499CrossRefGoogle Scholar
  8. 8.
    Ming Q, Ning J, Jiabao L et al (2004) Relationship between the yield strength and annealing temperature of a Cu film adherent to substrate. Acta Metall Sin 40(7):716–720Google Scholar
  9. 9.
    Jiang T, Im J, Huang R et al (2015) Through-silicon via stress characteristics and reliability impact on 3D integrated circuits. MRS Bull 40(03):248–256Google Scholar
  10. 10.
    Chen S, Qin F, An T et al (2016) Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron Reliab 63:183–193CrossRefGoogle Scholar
  11. 11.
    Heryanto A, Putra WN, Trigg A et al (2012) Effect of copper TSV annealing on via protrusion for TSV wafer fabrication. J Electron Mater 41:2533–2542Google Scholar
  12. 12.
    Xiangdong L, Haikuo Z, Xueyong W (2008) Effect of annealing temperature on microstructure and resistivity of Cu thin films. Semicond Technol 33(1):77–79Google Scholar

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© Springer Science+Business Media, LLC 2017

Authors and Affiliations

  1. 1.Tianjin Key Laboratory of Organic Solar Cells and Photochemical Conversion, School of Chemistry and Chemical EngineeringTianjin University of TechnologyTianjinChina

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