Acta Mechanica Sinica

, Volume 31, Issue 5, pp 601–626 | Cite as

Some recent advances in 3D crack and contact analysis of elastic solids with transverse isotropy and multifield coupling

Review Paper

Abstract

Significant progress has been made in mixed boundary-value problems associated with three-dimensional (3D) crack and contact analyses of advanced materials featuring more complexities compared to the conventional isotropic elastic materials. These include material anisotropy and multifield coupling, two typical characteristics of most current multifunctional materials. In this paper we try to present a state-of-the-art description of 3D exact/analytical solutions derived for crack and contact problems of elastic solids with both transverse isotropy and multifield coupling in the latest decade by the potential theory method in the spirit of V. I. Fabrikant, whose ingenious breakthrough brings new vigor and vitality to the old research subject of classical potential theory. We are particularly interested in crack and contact problems with certain nonlinear features. Emphasis is also placed on the coupling between the temperature field (or the like) and other physical fields (e.g., elastic, electric, and magnetic fields). We further highlight the practical significance of 3D contact solutions, in particular in applications related to modern scanning probe microscopes.

Keywords

Crack Contact Mixed boundary-value problem Transverse isotropy Multifield coupling Potential theory  Exact solution Scanning probe microscope 

Notes

Acknowledgments

This project was supported by the National Natural Science Foundation of China (Grant 11321202) and the Specialized Research Fund for the Doctoral Program of Higher Education (Grant  20130101110120).

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Copyright information

© The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences and Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  1. 1.Department of Engineering MechanicsZhejiang UniversityHangzhouChina

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