Microfluidics and Nanofluidics

, Volume 3, Issue 1, pp 119–122 | Cite as

Bonding of soda-lime glass microchips at low temperature

Short Communication


A simple, low-temperature bonding process is described for the fabrication of soda-lime glass microfluidic chips. Due to its chemical inertness and temperature stability, glass remains a popular material for microfluidic chips despite the advances that have been made with polymer materials. Conventional thermal bonding is performed over the course of 24 h at 600°C and requires a precise temperature-controlled furnace. Here we introduce a simple low-temperature alternative for the high-strength bonding of soda-lime glass wafers based on the use of diluted HF solution in combination with pressure at a temperature of 65°C.


Soda-lime glass microchips Pressure-assisted bonding Microchip fabrication 


  1. Chiem N, Lockyear-Shultz L, Andersson P, Skinner C, Harrison DJ (2000) Room temperature bonding of micromachined glass devices for capillary electrophoresis. Sens Actuators B 63:147–152CrossRefGoogle Scholar
  2. Jia ZJ, Fang Q, Fang ZL (2004) Bonding of glass microfluidic chips at room temperatures. Anal Chem 76:5597–5602CrossRefGoogle Scholar
  3. Nakanishi H, Abe H, Nishimoto T, Arai A (1998) Micro-fabrication and analytical performances of quartz and glass microchips for electrophoresis. Bunseki Kagaku 47:361–368Google Scholar
  4. Nakanishi H, Nishimoto T, Kanai M, Saitoh T, Nakamura R, Yoshida T, Shoji S (2000a) Condition optimization, reliability evaluation of SiO2–SiO2 HF bonding and its application for UV detection micro flow cell. Sens Actuators A 83:136–141CrossRefGoogle Scholar
  5. Nakanishi H, Nishimoto T, Nakamura R, Yotsumoto A, Yoshida T, Shoji S (2000b) Studies on SiO2–SiO2 bonding with hydrofluoric acid. Room temperature and low stress bonding technique for MEMS. Sens Actuators A 79:237–244CrossRefGoogle Scholar
  6. Pamme N, Manz A (2004) On-chip free-flow magnetophoresis: continuous flow separation of magnetic particles and agglomerates. Anal Chem 76:7250–7256CrossRefGoogle Scholar
  7. Sayah A, Solignac D, Cueni T, Gijs MAM (2000) Development of novel low temperature bonding technologies for microchip chemical analysis applications. Sens Actuators A 84:103–108CrossRefGoogle Scholar
  8. Wang HY, Foote RS, Jacobson SC, Schneibel JH, Ramsey JM (1997) Low temperature bonding for microfabrication of chemical analysis devices. Sens Actuators B 45:199–207CrossRefGoogle Scholar

Copyright information

© Springer-Verlag 2006

Authors and Affiliations

  1. 1.International Centre for Young Scientists (ICYS)National Institute for Materials Science (NIMS)IbarakiJapan
  2. 2.Horiike-GroupNIMSIbarakiJapan
  3. 3.Department of ChemistryUniversity of HullHullUK

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