Optical Review

, Volume 21, Issue 5, pp 655–658 | Cite as

Investigation of light extraction from light emitting module chip-on-board

  • Svetlana Lipnitskaya
  • Karim Mynbaev
  • Lidiya Nikulina
  • Vladimir Kramnik
  • Vladislav Bougrov
  • Alexey Kovsh
  • Maxim Odnoblyudov
  • Alexey Romanov
Special Section: The 9th International Conference on Optics-photonics Design & Fabrication “ODF’14, Itabashi, Tokyo” Regular Papers

Abstract

A research has been carried out on the optimization of the shape of encapsulating cover to minimize optical losses in light-emitting modules fabricated with the “chip-on-board” (COB) technology. Optical properties of the components of a typical COB were taken into account including those of the substrate, light-emitting chips, encapsulating material and phosphor particles. Light losses were analyzed for various types of encapsulant surface structuring in an attempt to design an optical element with maximum light extraction efficiency. Calculations were complemented with experimental measurements. The results of the research showed that structuring the surface of the encapsulant can enhance light extraction by 10 to 15% for the material without phosphor particles and by 10 to 14% for the material with phosphor particles.

Keywords

light extraction light-emitting module optical coating chip-on-board 

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Copyright information

© The Optical Society of Japan 2014

Authors and Affiliations

  • Svetlana Lipnitskaya
    • 1
    • 2
  • Karim Mynbaev
    • 1
    • 2
    • 3
  • Lidiya Nikulina
    • 2
  • Vladimir Kramnik
    • 2
  • Vladislav Bougrov
    • 1
    • 2
  • Alexey Kovsh
    • 1
    • 2
  • Maxim Odnoblyudov
    • 1
    • 2
  • Alexey Romanov
    • 1
    • 2
    • 3
  1. 1.ITMO UniversitySaint-PetersburgRussia
  2. 2.Optogan GroupSaint-PetersburgRussia
  3. 3.Ioffe InstituteSaint-PetersburgRussia

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