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Chinese Journal of Mechanical Engineering

, Volume 30, Issue 2, pp 419–427 | Cite as

Calibration of Discrete Element Heat Transfer Parameters by Central Composite Design

  • Zongquan DENG
  • Jinsheng CUI
  • Xuyan HOU
  • Shengyuan JIANG
Original Article

Abstract

The efficiency and precision of parameter calibration in discrete element method (DEM) are not satisfactory, and parameter calibration for granular heat transfer is rarely involved. Accordingly, parameter calibration for granular heat transfer with the DEM is studied. The heat transfer in granular assemblies is simulated with DEM, and the effective thermal conductivity (ETC) of these granular assemblies is measured with the transient method in simulations. The measurement testbed is designed to test the ETC of the granular assemblies under normal pressure and a vacuum based on the steady method. Central composite design (CCD) is used to simulate the impact of the DEM parameters on the ETC of granular assemblies, and the heat transfer parameters are calibrated and compared with experimental data. The results show that, within the scope of the considered parameters, the ETC of the granular assemblies increases with an increasing particle thermal conductivity and decreases with an increasing particle shear modulus and particle diameter. The particle thermal conductivity has the greatest impact on the ETC of granular assemblies followed by the particle shear modulus and then the particle diameter. The calibration results show good agreement with the experimental results. The error is less than 4%, which is within a reasonable range for the scope of the CCD parameters. The proposed research provides high efficiency and high accuracy parameter calibration for granular heat transfer in DEM.

Keywords

Granular assembly Parameter calibration Effective thermal conductivity (ETC) Discrete element method (DEM) Central composite design (CCD) Vacuum 

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Copyright information

© Chinese Mechanical Engineering Society and Springer-Verlag Berlin Heidelberg 2017

Authors and Affiliations

  • Zongquan DENG
    • 1
  • Jinsheng CUI
    • 1
  • Xuyan HOU
    • 1
  • Shengyuan JIANG
    • 1
  1. 1.Department of Mechatronics EngineeringHarbin Institute of TechnologyHarbinChina

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