Microsystem Technologies

, Volume 25, Issue 12, pp 4753–4759 | Cite as

Flip chip bonding using ink-jet printing technology

  • Hye-Lim Kang
  • Sung-min Sim
  • Yeonsu Lee
  • Jun Ho Yu
  • Kwon-Yong Shin
  • Sang-Ho LeeEmail author
  • Jung-Mu KimEmail author
Technical Paper


In this paper, a bump-forming method for flip chip bonding using ink-jet printing technology is proposed. A flip chip bonded transmission line using ink-jet printed silver bumps consisting of conductive ink containing silver nanoparticles was fabricated to verify the electrical characteristics after the flip chip bonding process. The transmission line was designed according to microstrip theory for a frequency range of 300 kHz to 3 GHz, with the size of fabricated line being 35 (width) × 8.64 (length) × 0.5 (thickness) mm3. The electrical characteristics of a reference microstrip and the flip chip bonded line were compared with FEM simulation and measurement results. Direct current (DC) resistances of both the reference line and the flip chip bonded line were measured to be 3.1 Ω and 3.2 Ω, respectively. The discrepancy between measured insertion loss and the simulation result was only 0.04 dB at 3 GHz, and the return loss was greater than 15 dB in the measurement frequency range. As a result of the analysis, it was confirmed that the DC resistance of ink-jet printed bumps account for 0.56% of the total DC resistance, and the ink-jet printed bumps hardly affected the radio frequency (RF) characteristics of the RF transmission line at low frequencies. The results demonstrate that ink-jet printed silver bumps can be used for a simple and low-cost flip chip bonding process. We expect that the proposed method can be applied to the packaging of various electronics such as flexible, wearable devices and RF applications.



This research was supported by “Research Base Construction Fund Support Program” funded by Chonbuk National University in 2019 and partially supported by the North Atlantic Treaty Organization (NATO), project SfP 984809. We would like to acknowledge the financial support from the Industrial Technology Innovation Program (Project No. 10063277) of the Ministry of Trade, Industry and Energy (MOTIE) of the Republic of Korea.


  1. Alimenti F, Mezzanotte P, Roselli L, Sorrentino R (2001) Modeling and characterization of the bonding-wire interconnection. IEEE Trans Microw Theory Tech 49:142–150CrossRefGoogle Scholar
  2. Estes RH, Kulesza FW (1991) Flip chip technology using electrically conductive polymers and dielectrics. U.S. Patent, No.5,074,947Google Scholar
  3. Gaynor MP (2006) System-in-package RF design and applications. Artech House, NorwoodzbMATHGoogle Scholar
  4. Gruber PA, Lauro PA, Nah JW (2014) Double solder bumps on substrates for low temperature flip chip bonding. U.S. Patent, No.8,828,860Google Scholar
  5. Hagelauer A, Wojnowski M, Pressel K, Weigel R, Kissinger D (2018) Integrated systems-in-package: heterogeneous integration of millimeter-wave-active circuits and passives in fan-out wafer-level packaging technologies. IEEE Microw Mag 19(1):48–56CrossRefGoogle Scholar
  6. Hayes DJ, Michael TM, David BW (1993) Method and apparatus for dispensing spherical-shaped quantities of liquid solder. U.S. Patent, No.5,229,016Google Scholar
  7. Huang S, DeLaCruz J (2017) Improvements of system-in-package integration and electrical performance using BVA wire bonding. IEEE Trans Compon Packag Manuf Technol 7(7):1020–1034CrossRefGoogle Scholar
  8. Jin H, Vahldieck R, Minkus H, Huang J (1994) Rigorous field theory analysis of flip-chip interconnections in MMICs using the RDTLM method. In: Microwave symposium digest, 1994, IEEE MTT-S international, pp 1711–1714Google Scholar
  9. Ko SH, Pan H, Grigoropoulos CP, Luscombe CK, Fréchet JM, Poulikakos D (2007) All ink-jet printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Nanotechnology 18(34):345202CrossRefGoogle Scholar
  10. Krems T, Haydl W, Massler H, Rudiger J (1996) Millimeter-wave performance of chip interconnections using wire bonding and flip chip. In: Microwave symposium digest, 1996, IEEE MTT-S international, vol 1, pp 247–250Google Scholar
  11. Mashayekhi M, Winchester L, Evans L, Pease T, Laurila MM, Mäntysalo M, Ogier S, Lluís T, Carrabina J (2016) Evaluation of aerosol, superfine inkjet, and photolithography printing techniques for metallization of application specific printed electronic circuits. IEEE Trans Electron Devices 63(3):1246–1253CrossRefGoogle Scholar
  12. Moon YJ, Kang H, Kang K, Moon SJ, Hwang JY (2015) Effect of thickness on surface morphology of silver nanoparticles layer during furnace sintering. J Electron Mater 44(4):1192–1199CrossRefGoogle Scholar
  13. Mueller M, Franke J (2017) Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics components. In: Electronics packaging technology conference, 2017 IEEE 19th. IEEE, pp 1–5Google Scholar
  14. Quack N, Sadie J, Subramanian V, Wu MC (2013) Through silicon vias and thermocompression bonding using inkjet-printed gold nanoparticles for heterogeneous MEMS integration. 2013 transducers & eurosensors XXVII: The 17th international conference on solid-state sensors, actuators and microsystems (TRANSDUCERS & EUROSENSORS XXVII), pp 834–837Google Scholar
  15. Saghlatoon H, Sydänheimo L, Ukkonen L, Tentzeris M (2014) Optimization of inkjet printing of patch antennas on low-cost fibrous substrates. IEEE Antennas Wirel Propag Lett 13:915–918CrossRefGoogle Scholar
  16. Sim S, Lee Y, Kang HL, Shin KY, Lee SH, Kim JM (2017) RF performance of ink-jet printed microstrip lines on rigid and flexible substrates. Microelectron Eng 168:82–88CrossRefGoogle Scholar
  17. Singh M, Haverinen HM, Dhagat P, Jabbour GE (2010) Inkjet printing-process and its applications. Adv Mater 22(6):673–685CrossRefGoogle Scholar
  18. Sternkiker C, Sowade E, Mitra KY, Zichner R, Baumann RR (2016) Upscaling of the inkjet printing process for the manufacturing of passive electronic devices. IEEE Trans Electron Devices 63(1):426–431CrossRefGoogle Scholar
  19. Strum H, Sosna C, Buchner R, Werner C, Godlinski D, Zollmer V, Busse M, Lang W (2009) New electrical connection technology for microsystems using inktelligent printing and functional nanoscaled inks. In: Solid-state sensors, actuators and microsystems conference, 2009. TRANSDUCER 2009. International. IEEE, pp 1702–1705Google Scholar
  20. Tong HM, Lai YS, Wong CP (2013) Advanced flip chip packaging. Springer US, New YorkCrossRefGoogle Scholar

Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Division of Electronics and Information EngineeringChonbuk National UniversityJeonjuRepublic of Korea
  2. 2.Korea Institute of Industrial TechnologyAnsanRepublic of Korea
  3. 3.Division of Electronic EngineeringChonbuk National UniversityJeonjuRepublic of Korea

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