In-situ 3D micro-sensor model using embedded plasmonic island for biosensors
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The design of the microsensor system for biosensors using the plasmonic island is proposed. The sensor head is formed by the stacked layers of silicon-graphene-gold materials. The dual-mode operations of the sensor can be performed using the relationship of the changes between the electron mobility and optical phase, where the exciting environment can be light intensity (phase), electrical transient, heat, pressure, flavour and smoke, The change in light phase (intensity) in silicon and conductivity (mobility) in gold layers cause change in the output measurands. The design and simulation interpretation of the sensor is presented. The sensor manipulation using the MCM arrangement is simulated and interpreted for biosensor applications 3D imaging can also be applied to the MCM function, where the 3D in situ sensor function is possible. The sensor sensitivity of 2.0 × 10−21 cm2 V−1 s−1 (mW)−1 via simulation is obtained.
M. S. Aziz would like to acknowledge the support and facilities through Flagship UTM Shine Project (03G82). P. Yupapin would like to acknowledge for the research facilities to Ton Duc Thang University, Vietnam. This is Prof. Ali UTM Shine cost center number is Q.J130000.2426.03G82 (Flagship UTM Shine).
- Faruki MJ, Razak MZA, Azzuhri SR, Rahman MT, Soltanian MRK, Rahman BMA, Grattan KTV, Rue RDL, Ahmad H (2016) Effect of titanium dioxide (TiO2) nanoparticle coating on the detection performance of microfiber knot resonator sensors for relative humidity measurement. Mater Express 6:501–508CrossRefGoogle Scholar
- Hourhout DV, Baets R (2012) Silicon micro-ring resonators. Laser Photon Rev 6910:47–73Google Scholar
- Morrill D, Li D, Pacifici D (2010) Measuring subwavelength spatial coherence with plasmonic interferometry. Nat Photonics 10:661–687Google Scholar
- Phattharacorn P, Chiangga S, Ali J, Yupapin P (2018) Micro-optical probe model using integrated triple microring resonators for vertical depth identification. Microsyst Technol (accepted) Google Scholar