Microsystem Technologies

, Volume 23, Issue 7, pp 2727–2738 | Cite as

Fringing capacitance and tolerance of DRIE effect on the performance of bulk silicon comb-drive actuator

  • Chunhua Cai
  • Ming Qin
Technical Paper


A bulk silicon comb-drive actuator with low driving voltage and large displacement is presented in this paper. The bulk silicon comb-drive actuator is fabricated by a simple bulk micromachining process based on the low temperature Au–Au bonding technology. A cascade folded beam is designed to improve the displacement of comb-drive actuator at low driving voltages. The instability of the whole system decreases by utilizing unequal wide comb fingers design. The fringing capacitance and the fabrication tolerances together with their effects on the performances of the comb-drive actuators are also discussed. The measurement results show that the capacitance change rate and the displacement change rate of the comb-drive actuator are 1.5 fF/V2 and 0.125 μm/V2, respectively. The displacement of the actuator can reach 28.5 μm at 15 V driving voltages. The experimental results of the comb-drive actuator are in good agreement with the modified theoretical predictions.


Slope Angle Stiffness Ratio Chemical Mechanical Planarization Fabrication Tolerance Comb Finger 
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This work is supported by the Fundamental Research Funds for the Central Universities (2014B02014), the National Natural Science Foundation of China (11574072) and the National High Technology Research and Development Program of China (863 Program, 2013AA041106).


  1. Chen B, Miao J (2007) Influence of deep RIE tolerances on comb-drive actuator performance. J Phys D Appl Phys 40:970–976CrossRefGoogle Scholar
  2. Chen YC, Chang ICM, Chen R, Houc MTK (2008) On the side instability of comb-fingers in MEMS electrostatic devices. Sens Actuators A 148:201–210CrossRefGoogle Scholar
  3. Chiou JC, Kuo CF (2007) Development of vertical electrostatic comb-drive actuator using magnified cascade configuration. Jpn J Appl Phys 46:6546–6549CrossRefGoogle Scholar
  4. Erismis MA, Neves HP, Moor PD, Puers R, Hoof CV (2010) A water-tight packaging of MEMS electrostatic actuators for biomedical applications. J Microsyst Technol 16:2109–2113CrossRefGoogle Scholar
  5. Franke AE, Heck JM, King TJ, Howe RT (2003) Polycrystalline silicon-germanium films for integrated microsystems. J Microelectromech Syst 12:160–171CrossRefGoogle Scholar
  6. Gerson Y, Krylov S, Ilic B, Schreiber D (2008) Large displacement low voltage multistable micro actuator. In: Proceedings of the IEEE 21st international conference on micro electro mechanical systems, pp 463–466Google Scholar
  7. Grade JD, Jerman H, Kenny TW (2003) Design of large deflection electrostatic actuators. J Microelectromech Syst 12:335–343CrossRefGoogle Scholar
  8. Gu L, Li X, Bao H, Liu B, Wang Y, Liu M, Yang Z, Cheng B (2006) Single–wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology. J Micromech Microeng 16:1349–1357CrossRefGoogle Scholar
  9. Guo Z, Meng Y, Wu H, Su C, Wenb S (2007) Measurement of static and dynamic friction coefficients of sidewalls of bulk-microfabricated MEMS devices with an on-chip micro-tribotester. Sens Actuators A 135:863–869CrossRefGoogle Scholar
  10. Jing E, Xiong B, Wang YL (2010) Low temperature Au–Si wafer bonding. J Micromech Microeng 20:095014–095016CrossRefGoogle Scholar
  11. Krylov S, Bernstein Y (2006) Large displacement parallel plate electrostatic actuator with saturation type characteristic. Sens Actuators A 130–131:497–512CrossRefGoogle Scholar
  12. Lee JY, Kim SH, Lim HT, Kim CH, Baek CW, Kim YK (2003) Electric spring modeling for a comb actuator deformed by the footing effect in deep reactive ion etching. J Microelectromech Syst 13:72–79Google Scholar
  13. Li J, Zhang QX, Liu AQ (2003) Advanced fiber optical switches using deep RIE (DRIE) fabrication. Sens Actuators A 103:286–295CrossRefGoogle Scholar
  14. Li J, Liu AQ, Zhang QX (2006) Tolerance analysis of comb-drive actuators using DRIE fabrication. Sens Actuators A 125:494–503CrossRefGoogle Scholar
  15. Liu X, Tong J, Sun Y (2007) A millimeter-sized nanomanipulator with sub-nanometer positioning resolution and large force output. Smart Mater Struct 16:1742–1750CrossRefGoogle Scholar
  16. Tang WC, Nguyen TCH, Howe RT (1989) Laterally driven polysilicon resonant microstructures. Sens Actuators A 20:25–32CrossRefGoogle Scholar
  17. Wang K, Sinclair M, Starkweather GK, Böhringer KF (2007) An electrostatic zigzag transmissive microoptical switch for MEMS displays. J Microelectromech Syst 16:140–154CrossRefGoogle Scholar
  18. Wolffenbuttel RF, Wise KD (1994) Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature. Sens Actuators A 43:223–229CrossRefGoogle Scholar
  19. Xiao Z, Peng W, Wolffenbuttel RF, Farmer KR (2003) Micromachined variable capacitors with wide tuning range. Sens Actuators A 104:299–305CrossRefGoogle Scholar
  20. Ye W, Mukherjee S, Macdonald NC (1998) Optimal shape design of an electrostatic comb drive in micromechanical systems. J Microelectromech Syst 7:16–26CrossRefGoogle Scholar
  21. Zhou G, Dowd P (2003) Tilted folded-beam suspension for extending the stable travel range of comb-drive actuators. J Micromech Microeng 13:303–306Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.College of Internet of ThingsHohai UniversityNanjingChina

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