Microsystem Technologies

, Volume 23, Issue 1, pp 125–133 | Cite as

Novel shock wave excitation method for dynamic characterization of microstructures

  • Dongsheng She
  • Yiliu Yang
  • Zefei Wei
  • Kun Li
  • Zhen Yu
  • Feng Ding
Technical Paper
  • 129 Downloads

Abstract

A novel shock wave excitation method for dynamic characterization of MEMS microstructures was proposed. A typical shock wave excitation device mainly includes a needle electrode, a plate electrode, a high-voltage capacitor, a base structure and a feeder. The principle of this method is as follows. The testing microstructure was installed on the surface of the base structure supported by a rigid platform. The plate electrode was attached on the opposite surface. The needle electrode was mounted on the feeder. Adjusting the feeder, the shock wave will be generated as soon as the gap distance between two electrodes meets the requirements of electrical discharging. The base structure will be impacted by the shock wave. Thus the testing microstructure will be excited by the movement of the base structure. A dynamic measurement system for microcantilevers were developed. In the system, the shock wave excitation device was used to excite the testing microcantilevers. T-shaped piezoresistive microcantilevers were fabricated to get the vibration response. The experiments on the dynamic characteristics measurement for microcantilevers were carried out. The results show the shock wave excitation method is effective for MEMS dynamic characterization.

Keywords

Shock Wave Extracorporeal Shock Wave Lithotripsy Needle Electrode Plate Electrode Excitation Method 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgments

This work was supported by the National Natural Science Foundation of China (Grant No. 51305191) and the General Project of Liaoning Provincial Education Department of China (Grant No. L2015009).

Compliance with ethical standards

Conflict of interest

The authors declared that they have no conflicts of interest to this work.

References

  1. Burdess JS, Harris AJ, Wood D, Pitcher RJ, Glennie D (1997) A system for the dynamic characterization of microstructures. J Microelectromech Syst 6(4):322–328. doi: 10.1109/84.650129 CrossRefGoogle Scholar
  2. Castellini P, Martarelli M, Tomasini EP (2006) Laser Doppler vibrometry: development of advanced solutions answering to technology’s needs. Mech Syst Signal Process 20(6):1265–1285. doi: 10.1016/j.ymssp.2005.11.015 CrossRefGoogle Scholar
  3. Davis CQ, Freeman DM (1998) Using a light microscope to measure motions with nanometer accuracy. Opt Eng 37(4):1299–1304. doi: 10.1117/1.601967 CrossRefGoogle Scholar
  4. Flynn EB, Bassman LC, Smith TP, Lalji Z, Fullerton LH, Leung TC, Koskelo AC (2006) Three-wavelength electronic speckle pattern interferometry with the Fourier-transform method for simultaneous measurement of microstructure-scale deformations in three dimensions. Appl Opt 45(14):3218–3225. doi: 10.1364/AO.45.003218 CrossRefGoogle Scholar
  5. Hart MR, Conant R, Lau KY, Muller RS (2000) Stroboscopic interferometer system for dynamic MEMS characterization. J Microelectromech Syst 9(4):409–418. doi: 10.1109/84.896761 CrossRefGoogle Scholar
  6. Hu X, Hu C, Chen Z, Guo T, Hu X (2007) Measuring in-plane and out-of-plane coupled motions of microstructures by stroboscopic microscopic interferometry. Opt Laser Technol 39(6):1176–1182. doi: 10.1016/j.optlastec.2006.08.013 CrossRefGoogle Scholar
  7. Kanel GI, Razorenov SV, Fortov VE (2004) Shock-wave phenomena and the properties of condensed matter. Springer, New York. doi:  10.1007/978-1-4757-4282-4
  8. Kang X, Tay CJ, Quan C, He XY (2007) Dynamic characterization of MEMS structures by ultrasonic wave excitation. J Micromech Microeng 17(12):2426–2431. doi: 10.1088/0960-1317/17/12/006 CrossRefGoogle Scholar
  9. Kim P, Bae S, Seok J (2012) Resonant behaviors of a nonlinear cantilever beam with tip mass subject to an axial force and electrostatic excitation. Int J Mech Sci 64(1):232–257. doi: 10.1016/j.ijmecsci.2012.06.008 CrossRefGoogle Scholar
  10. Kon S, Oldham K, Horowitz R (2007) Piezoresistive and piezoelectric MEMS strain sensors for vibration detection. In: The 14th international symposium on: smart structures and materials and nondestructive evaluation and health monitoring, 2007: 65292V–65292V-11. doi:  10.1117/12.715814
  11. Littrell R, Grosh K (2012) Modeling and characterization of cantilever-based MEMS piezoelectric sensors and actuators. J Microelectromech Syst 21(2):406–413. doi: 10.1109/JMEMS.2011.2174419 CrossRefGoogle Scholar
  12. Lu QH, Zhang XM, Fan YB (2009) Robust multiscale method for in-plane micro-motion measurement based on computer micro-vision. Chin J Mech Eng 45(2):164–169. doi: 10.3901/JME.2009.02.164 CrossRefGoogle Scholar
  13. Partridge A, Reynolds JK, Chui BW et al (2000) A high-performance planar piezoresistive accelerometer. J Microelectromech Syst 9(1):58–66. doi: 10.1109/84.825778 CrossRefGoogle Scholar
  14. Rassweiler JJ, Knoll T, Köhrmann KU et al (2011) Shock wave technology and application: an update. Eur Urol 59(5):784–796. doi: 10.1016/j.eururo.2011.02.033 CrossRefGoogle Scholar
  15. Read DT (1998) Young’s modulus of thin films by speckle interferometry. Meas Sci Technol 9(4):676. doi: 10.1088/0957-0233/9/4/016 CrossRefGoogle Scholar
  16. Sharma A, Mukhiya R, Kumar SS, Gopal R, Pant BD (2014) Dynamic characterization of bulk micromachined accelerometer using laser doppler vibrometer (LDV). Microsyst Technol 9:1–12. doi: 10.1007/s00542-014-2316-3 Google Scholar
  17. Shi HC, Fan SC, Zhang YW, Sun JH (2015) Nonlinear dynamics study based on uncertainty analysis in electro-thermal excited MEMS resonant sensor. Sens Actuators A 232:103–114. doi: 10.1016/j.sna.2015.05.016 CrossRefGoogle Scholar
  18. Wang XD, Li N, Wang T, Liu MW, Wang LD (2007) Dynamic characteristic testing for MEMS micro-devices with base excitation. Meas Sci Technol 18(6):1740–1747. doi: 10.1088/0957-0233/18/6/S12 CrossRefGoogle Scholar
  19. Wilson CJ, Bogy DB (1996) An experimental modal analysis technique for miniature structures. J Vib Acoust 118:1–9. doi: 10.1115/1.2889629 CrossRefGoogle Scholar
  20. Xiong X, Wu YLD, Jone WB (2005) A dual-mode built-in self-test technique for capacitive MEMS devices. IEEE Trans Instrum Meas 54(5):1739–1750. doi: 10.1109/TIM.2005.855094 CrossRefGoogle Scholar
  21. Xiong L, Zhou Q, Wu Y, Chen P (2015) New laser excitation method for modal analysis of microstructure. Mech Syst Signal Process 50:227–234. doi: 10.1016/j.ymssp.2014.05.012 CrossRefGoogle Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  • Dongsheng She
    • 1
  • Yiliu Yang
    • 2
  • Zefei Wei
    • 1
  • Kun Li
    • 1
  • Zhen Yu
    • 1
  • Feng Ding
    • 3
  1. 1.College of EngineeringBohai UniversityJinzhou CityChina
  2. 2.Research and Teaching Institute of College Computer ScienceBohai UniversityJinzhou CityChina
  3. 3.School of Software TechnologyDalian University of TechnologyDalian CityChina

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