Microsystem Technologies

, Volume 21, Issue 8, pp 1587–1593 | Cite as

Three-dimensional simulation of surface topography evolution in the Bosch process by a level set method

  • Xiao-Qian Li
  • Zai-Fa Zhou
  • Wei-Hua Li
  • Qing-An Huang
Technical Paper
First Online:
Received:
Accepted:

Abstract

A deep reactive ion etching (DRIE) process (Bosch process) is used extensively in the fabrication of microelectromechanical systems (MEMS). Modeling and simulation studies have helped improve our understanding and process design. The Bosch process consists of multiple cycles of alternating etching and deposition steps. Based on a narrow band level set method, by integrating etching simulation and deposition simulation modules, a simulation system is proposed for three-dimensional (3-D) simulation of the Bosch process with arbitrarily complex mask shapes. To verify the simulation system, a series of simulations and experiments have been performed. The simulation results are in good agreement with the experiments. The method may be used to optimize the practical Bosch process and to design and control the profile of high-aspect ratio microstructures.

Keywords

Trench Deposition Step Bosch Process Full Matrix Method Particle Transport Model 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Notes

Acknowledgments

This project is partly supported by the National S&T Major Project under contract no. 2011ZX02507-001-003 and by the Science Foundation of Jiangsu Province under contract no. DZXX-149-092.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2014

Authors and Affiliations

  • Xiao-Qian Li
    • 1
  • Zai-Fa Zhou
    • 1
  • Wei-Hua Li
    • 1
  • Qing-An Huang
    • 1
  1. 1.Key Laboratory of MEMS of the Ministry of EducationSoutheast UniversityNanjingChina

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