Microsystem Technologies

, Volume 20, Issue 8–9, pp 1529–1534 | Cite as

An investigation of thermal asperity sensors during contact with disk asperities

  • Chuanwei Zhang
  • Andrey Ovcharenko
  • Min Yang
  • Neil Knudson
  • Frank E. Talke
Technical Paper
First Online:
Received:
Accepted:

Abstract

In this study, a thermo-mechanical finite element model was developed for the response of a thermal asperity sensor sliding against a disk asperity. The temperature change of the thermal asperity sensor due to frictional heating was determined. The effect of disk asperity material properties and contact conditions is investigated.

Keywords

Frictional Heat Frictional Heating Flash Temperature Thermal Protrusion Large Temperature Change 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

List of symbols

lTAS

Length of the thermal asperity sensor

wTAS

Width of the thermal asperity sensor

tTAS

Thickness of the thermal asperity sensor

RTA/tTAS

Normalized cap radius of the asperity

dTA/tTAS

Normalized cylinder diameter of the asperity

hTA/tTAS

Normalized asperity height

RTP/tTAS

Normalized radius of the thermal protrusion on the slider

δ/tTAS

Normalized interference between the thermal protrusion of the slider and the disk asperity

D/tTAS

Normalized distance of asperity to thermal asperity sensor

Vx/V0

Normalized circumferential velocity of the disk, where V 0 is 20 m/s

TR

Room temperature

T1/TR

Normalized initial temperature of Al2O3 #1 slider region

T2/TR

Normalized initial temperature of Al2O3 #2 slider region

TTAS/TR

Normalized operational temperature of the thermal asperity sensor

T/TR

Normalized temperature of the thermal asperity sensor

t/t0

Normalized total contact time, where t 0  = 1 μs

Tb

Bulk temperature

μ

Frictional coefficient

F

Normal force acting on sliding surfaces

Ar

Actual contact area

k1, k2

Thermal conductivities of surfaces 1 and 2

l1f, l2f

Equivalent linear heat-diffusion distances for surfaces 1 and 2

This is a preview of subscription content, log in to check access.

Notes

Acknowledgments

We would like to thank Dr. Roger Lo and Dr. David Fowler from Western Digital Corporation for helpful discussions and suggestions with this paper. Chuanwei Zhang thanks the China Scholarship Council (CSC) and Prof. Le Gu from Harbin Institute of Technology, for supporting his Ph.D. studies at UCSD.

References

  1. Ashby MF, Abulawi J, Kong HS (1991) Temperature maps for frictional heating in dry sliding. Tribol Trans 34(4):577–587CrossRefGoogle Scholar
  2. Blok H (1937) Theoretical study of temperature rise at surfaces of actual contact under oiliness lubricating conditions. Proc Inst Mech Eng Gen Discuss Lubr 2:222–235Google Scholar
  3. Erden MF, Kurtas EM (2004) Thermal asperity detection and cancellation in perpendicular magnetic recording systems. IEEE Trans Magn 40(3):1732–1737CrossRefGoogle Scholar
  4. Hallquist JO (2006) LS-DYNA theoretical manual. Livermore Software Technology Corporation, LivermoreGoogle Scholar
  5. Kools JCS (1996) Exchange-biased spin-valves for magnetic storage. IEEE Trans Magn 32(4):3165–3184CrossRefGoogle Scholar
  6. Kurita M, Xu J, Tokuyama M, Nakamoto K, Saegusa S, Maruyama Y (2005) Flying-height reduction of magnetic-head slider due to thermal protrusion. IEEE Trans Magn 41(10):3007–3009CrossRefGoogle Scholar
  7. Lee S, Yeo C-D (2011) Thermal–mechanical contact and micro-wear in head disk interface. In: ASME/STLE international joint tribology conferenceGoogle Scholar
  8. Li H, Zheng H, Fritzsche J, Amemoya K, Talke FE (2010) Simulation of flying height and response time of thermal flying height control sliders with thermal insulators. IEEE Trans Magn 46(6):1292–1294CrossRefGoogle Scholar
  9. Li J, xu J, liu J, Kohira H (2012) Thermal mechanical of contact sensor using in hard disk drives. ASME information storage and processing systems conferenceGoogle Scholar
  10. Liu J, Xu J, Li J (2012) Simulation studies of contact sensor for disk defect mapping. ASME-ISPS/JSME-IIP joint international conferenceGoogle Scholar
  11. Mathew G, Tjhia I (2005) Thermal asperity suppression in perpendicular recording channels. IEEE Trans Magn 41(10):2878–2880CrossRefGoogle Scholar
  12. Nogues J, Schuller IK (1999) Exchange bias. J Magn Magn Mater 192:203–232CrossRefGoogle Scholar
  13. Pinarbasi M, Metin S, Gill H, Parker M, Gurney B, Carey M et al (2000) Antiparallel pinned NiO spin valve sensor for GMR head application. J Appl Phys 87(9):5714–5719CrossRefGoogle Scholar
  14. Sharma V, Kim SH, Choa SH (2001) Head and media design considerations for reducing thermal asperity. Tribol Int 34(5):307–314CrossRefGoogle Scholar
  15. Shimizu Y, Xu J, Kohira H et al (2011) Nano-scale defect mapping on a magnetic disk surface using a contact sensor. IEEE Trans Magn 47(10):3426–3432CrossRefGoogle Scholar
  16. Song W, Ovcharenko A, Yang M, Zheng H, Talke FE (2012a) Contact between a thermal flying height control slider and a thermal asperity. Microsyst Technol 18:1549–1557CrossRefGoogle Scholar
  17. Song W, Ovcharenko A, Knigge B, Yang M, Talke FE (2012b) Effect of contact conditions during thermo-mechanical contact between a thermal flying height control slider and a disk asperity. Tribol Int 55:100–107CrossRefGoogle Scholar
  18. Stupp SE, Baldwinson MA, Mcewen P (1999) Thermal asperity trends. IEEE Trans Magn 35(2):752–757CrossRefGoogle Scholar
  19. Wood R (2000) The feasibility of magnetic recording at 1 terabit per square inch. IEEE Trans Magn 36:36–42CrossRefGoogle Scholar
  20. Yuan Z, Liu B (2000) Anti-thermal asperity head: design and performance analysis. J Magn Magn Mater 209(1–3):166–168CrossRefGoogle Scholar
  21. Zhao D, Wei X, Liu B et al (2013) Thermal asperity sensor application to hard disk drive operational Shock. IEEE Trans Magn 49(2):699–702CrossRefGoogle Scholar
  22. Zheng H, Li H, Talke FE (2009) Numerical simulation of a thermal flying height control slider with dual heater and insulator elements. IEEE Trans Magn 45(10):3628–3631CrossRefGoogle Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2014

Authors and Affiliations

  • Chuanwei Zhang
    • 1
    • 3
  • Andrey Ovcharenko
    • 2
  • Min Yang
    • 2
  • Neil Knudson
    • 2
  • Frank E. Talke
    • 3
  1. 1.School of Mechatronics EngineeringHarbin Institute of TechnologyHarbinPeople’s Republic of China
  2. 2.Western Digital CorporationSan JoseUSA
  3. 3.Center for Magnetic Recording ResearchUniversity of CaliforniaSan DiegoUSA

Personalised recommendations