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Microsystem Technologies

, Volume 20, Issue 10–11, pp 2017–2022 | Cite as

Infrared heated μ-blistering, a new fabrication technology for HARMST

  • Thomas SchmidtEmail author
  • Claas Mueller
  • Holger Reinecke
Technical Paper
  • 162 Downloads

Abstract

Polymeric replication technologies such as injection moulding or hot-embossing have gained wide acceptance in the microtechnological community, microthermoforming of thin polymer foils, also called μ-blistering, still remains relatively unknown. Although the general potentials of the µ-blistering have already been pointed out, little work has been carried out addressing its capability for high aspect ratio microstructuring. In the scope of this work we therefore demonstrate the feasibility of μ-blistering to obtain aspect ratios for free standing structures of up to 7 within a process cycle time of <4 min. The presented processing technology uniquely combines manufacturing of macro-, micro- and even nanoscopic feature sizes in a single process.

Keywords

High Aspect Ratio Silicone Rubber Draw Ratio Mould Insert Master Mould 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgments

We would like to thank the Laboratory for MEMS Applications at IMTEK (Freiburg), for kindly providing a master for microfluidic applications and Gabi Gruetzner of micro resist technology GmbH (Berlin) for provision of the ultra-thick dry-film resist prototype.

References

  1. Becker H, Heim U (2000) Hot embossing as a method for the fabrication of polymer high aspect ratio structures. Sens Actuators A Phys 83(1–3):130–135CrossRefGoogle Scholar
  2. Becker H, Locascio LE (2002) Polymer microfluidic devices. Talanta 56(2):267–287CrossRefGoogle Scholar
  3. Disch A, Mueller C, Reinecke H (2007) Low cost production of disposable microfluidics by blister packaging technology, EMBC ‘07, pp 6322–6325Google Scholar
  4. Focke M, Stumpf F, Faltin B, Roth G, Zengerle R, von Stetten F (2010a) Centrifugal microfluidic system for primary amplification and secondary real-time PCR. Lab Chip 10:3210–3212CrossRefGoogle Scholar
  5. Focke M, Kosse D, Müller C, Reinecke H, Zengerle R, von Stetten F (2010b) Lab-on-a-foil: microfluidics on thin and flexible films. Lab Chip 10:1365–1386CrossRefGoogle Scholar
  6. Gottwald E, Giselbrecht S, Augspurger C, Lahni B, Dambrowsky N, Truckenmueller R, Piotter V, Gietzelt T, Wendt O, Pfleging W, Welle A, Rolletschek A, Wobusi AM, Weibezahn K-F (2007) A chip-based platform for the in vitro generation of tissues in threedimensional organization. Lab Chip 7:777–785CrossRefGoogle Scholar
  7. Schmidt T, Mueller C (2012) μ-Blistering for fast reproduction of microoptical components in polymers, ACAPOLY-workshop, EPFL Lausanne, SwitzerlandGoogle Scholar
  8. Schmidt T, Mueller C, Reinecke H (2011) Wirtschaftliche Fertigung dünnwandiger Mikrobauteile in technischen Polymeren mittels Tiefziehen (μ-blistering), Proceedings Mikrosystemtechnik Kongress, Darmstadt, pp 622–625Google Scholar
  9. Throne J (2008) Understanding thermoforming, 2nd edn. Carl Hanser, MunichCrossRefGoogle Scholar
  10. Truckenmueller R, Rummler Z, Schaller T, Schomburg W (2002) Low-cost thermoforming of micro fluidic analysis chips. J Micromech Microeng 12:375–379CrossRefGoogle Scholar
  11. Wu J-T, Chang W-Y, Yang S-Y (2010) Fabrication of a nano/micro hybrid lens using gas-assisted hot embossing with an anodic aluminum oxide (AAO) template. J Micromech Microeng 20(7):5023–5029Google Scholar
  12. Zhao Y, Cui T (2003) Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique. J Micromech Microeng 13(3):430–435CrossRefGoogle Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2014

Authors and Affiliations

  • Thomas Schmidt
    • 1
    Email author
  • Claas Mueller
    • 1
  • Holger Reinecke
    • 1
    • 2
  1. 1.Laboratory for Process Technology, Department of Microsystems Engineering, IMTEKUniversity of FreiburgFreiburgGermany
  2. 2.HSG-IMIT, Institut für Mikro- und InformationstechnikVillingen-SchwenningenGermany

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