Microsystem Technologies

, Volume 19, Issue 5, pp 689–695 | Cite as

Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy

  • Falk Naumann
  • Sebastian Brand
  • Michael Bernasch
  • Sebastian Tismer
  • Peter Czurratis
  • Dirk Wünsch
  • Matthias Petzold
Technical Paper
First Online:
Received:
Accepted:

Abstract

Glass frit bonding is a widely used encapsulation technology for micro-electro mechanical systems. In order to guarantee functionality and reliability of a bonding seal, qualified test methods are required for evaluating the quality and strength of the bonding interfaces which are considered key parameters. In the presented work adapting the micro-chevron-test for glass frit bonded samples and arising challenges are discussed. Motivated by the industrial application of glass frit bonding generally used for frame structures an application related guideline for the application of micro-chevron-testing is presented. In addition, high resolution acoustic inspection is used as a key technology for estimating the effective bond strength in combination with further experimental testing and is likewise used for sample pre-selection and defect localization. The presented content provides a sequential overview beginning with sample preparation of glass frit bonded micro chevron samples to mechanical testing and the result analysis as well as a statistical interpretation of a bonded silicon test wafer.

Keywords

Fracture Toughness Chevron Glass Frit Bond Pressure Fracture Force 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
This is a preview of subscription content, log in to check access.

Notes

Acknowledgments

This work was partly supported by the German Ministry of Economics and Technology BMBF under contract “FEMIK” (FKZ01FS10028) and partly funded within the project ESIP granted by the BMBF under contract 13N10971 and by the ENIAC JU.

References

  1. Bagdahn J (2000) Festigkeit und Lebensdauer direkt gebondeter Siliziumwafer unter mechanischer Belastung. Dissertation, Martin-Luther-Universität Halle-WittenbergGoogle Scholar
  2. Dresbach C, Krombholz A, Ebert M, Bagdahn J (2006) Mechanical properties of glass frit bonded micro packages. Microsyst Technol 12:473–480CrossRefGoogle Scholar
  3. Glien K (2007) Dichtheit und lebensdauer glas-frit gebondeter mikromechanischer inertialsensoren. Dissertation, Technische Universität KarlsruheGoogle Scholar
  4. Knechtel R (2005) Halbleiterwaferbondverbindungen mittels strukturierter glaszwischenschichten zur verkapselung oberflächenmikromechanischer sensoren auf waferebene. Dissertation, Technischen Universität ChemnitzGoogle Scholar
  5. Petzold M, Knoll H, Bagdahn J (2001) Strength assessment of wafer-bonded micromechanical components using the micro-chevron-test. In: Ramesham R (ed) Proceedings SPIE 2001: Micromachining and microfabrication, vol 4558, Reliability, testing, and characterization of MEMS/MOEMS, San Francisco, pp 133–142Google Scholar
  6. Petzold M, Dresbach C, Ebert M, Bagdahn J, Wiemer M, Glien K, Graf J, Müller-Fiedler R, Höfer H (2006) Fracture mechanical life-time investigation of glass-frit bonded MEMS sensors. In: Proceedings ITHERM 2006, San Diego, CA, pp 1343–1348Google Scholar

Copyright information

© Springer-Verlag 2012

Authors and Affiliations

  • Falk Naumann
    • 1
  • Sebastian Brand
    • 1
  • Michael Bernasch
    • 1
  • Sebastian Tismer
    • 4
  • Peter Czurratis
    • 2
  • Dirk Wünsch
    • 3
  • Matthias Petzold
    • 1
  1. 1.Fraunhofer Institute for Mechanics of Materials IWMHalleGermany
  2. 2.PVA TePla Analytical Systems GmbHWesthausenGermany
  3. 3.Fraunhofer Institute for Electronic Nano Systems ENASChemnitzGermany
  4. 4.Physics Department, µ-MD GroupUniversity of Halle-WittenbergHalleGermany

Personalised recommendations