Microsystem Technologies

, 17:443 | Cite as

Soft lithography replication based on PDMS partial curing

  • Hongbin Yu
  • Guangya Zhou
  • Fook Siong Chau
  • Sujeet K. Sinha
Technical Paper


In this paper, a partial curing technique is presented. Its aim is to enable the soft lithography replication process for the case requiring usage of PDMS mold. Through controlling the curing time during molding step, the liquid PDMS prepolymer in original status, which will later constitute the device substrate, can be partially polymerized as well as solidified. As a result, not only can the structural pattern in the mold be successfully transferred into the device layer, but also the spontaneous adhesive interaction between these two PDMS parts happening during curing can be effectively limited within very low level, thus largely facilitating the demoulding process. Based on this process, several devices have been successfully developed and high fidelity pattern transfer capability has also been demonstrated. Comparing with the most commonly used treatments such as silanization, the presented method demonstrates easier operation and better user-friendly interface advantages.


Mold PDMS Root Mean Square Soft Lithography PDMS Mold 



Financial support by the National Research Foundation (NRF), Singapore under Award No. NRF-CRP 2-2007-04 is gratefully acknowledged.


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Copyright information

© Springer-Verlag 2011

Authors and Affiliations

  • Hongbin Yu
    • 1
  • Guangya Zhou
    • 1
  • Fook Siong Chau
    • 1
  • Sujeet K. Sinha
    • 2
  1. 1.Micro/Nano Systems Initiative Technology, Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore
  2. 2.Material Laboratory, Department of Mechanical EngineeringNational University of SingaporeSingaporeSingapore

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