Microsystem Technologies

, Volume 16, Issue 7, pp 1051–1055

3D System-on-Chip technologies for More than Moore systems

  • Peter Ramm
  • Armin Klumpp
  • Josef Weber
  • Maaike M. V. Taklo
Technical Paper

Abstract

3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products. Through silicon via (TSV) technologies enable high interconnect performance compared to 3D packaging. At present TSVs are associated with a relatively high fabrication cost, but research world wide strive to bring the cost down to an acceptable level. An example of a 3D System-on-Chip (3D-SOC) technology is to introduce a post backend-of-line TSV process as an optimized technology for heterogeneous system integration. The introduced ICV-SLID process, that combines both TSVs and bonding, enables 3D integration of fabricated devices. Reliability issues related to thermo-mechanical stress caused by the TSV formation and the bonding are considered. 3D-SOC technology choices made to realize a heterogeneous ultra-small IC stack for a wireless tire pressure monitoring system (TPMS) as an automotive application are described.

References

  1. Arkalgud S (2008) SEMATECH 3-D TSV technology development. In: Proceedings of the international 3D system integration conference 3D-SIC 2008. Tokyo, JapanGoogle Scholar
  2. e-CUBES project (2009) http://www.ecubes.org
  3. Garrou P, Bower C, Ramm P (2008) Handbook of 3D integration. Wiley-VCH, New York, ISBN: 978-3-527-32034-9Google Scholar
  4. I-micronews (Yole Developpement) (2008) 3D IC, WLP and TSV packaging newsletter. http://www.imicronews.com
  5. International Technology Roadmap for Semiconductors (ITRS) (2007) http://www.public.itrs.net
  6. Ramm P, Wolf J, Wunderle B (2008a) Wafer-level 3D system integration. In: Handbook of 3D integration. Wiley-VCH, New YorkGoogle Scholar
  7. Ramm P, Wolf J, Klumpp A, Wieland R, Wunderle B, Michel B (2008b) Through silicon via technology. In: Proceedings of the 58th ECTC. Lake Buena Vista, FLGoogle Scholar
  8. Schjølberg-Henriksen K, Taklo MMV, Lietaer N, Prainsack J, Dielacher M, Klein M, Wolf MJ, Weber J, Ramm P, Seppänen T (2009) Miniaturised sensor node for tire pressure monitoring (e-CUBES). Advanced microsystems for automotive applications 2009 (s. 313–332). Springer, BerlinGoogle Scholar

Copyright information

© Springer-Verlag 2009

Authors and Affiliations

  • Peter Ramm
    • 1
  • Armin Klumpp
    • 1
  • Josef Weber
    • 1
  • Maaike M. V. Taklo
    • 2
  1. 1.Munich DivisionFraunhofer Institute for Reliability and MicrointegrationMunichGermany
  2. 2.Department for Microsystems and NanotechnologySINTEFOsloNorway

Personalised recommendations