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Microsystem Technologies

, 16:487 | Cite as

Thermal bonding of PMMA: effect of polymer molecular weight

  • Nimai C. NayakEmail author
  • C. Y. Yue
  • Y. C. Lam
  • Y. L. Tan
Technical Paper

Abstract

Microfluidics devices have attracted increasing interest over the last decade. Glass was initially the materials of choice for these devices but polymers such as polymethylmethacrylate (PMMA) have a great potential to be used for these devices because of their low cost, ease of fabrication and chemical properties. A key step in fabrication of these microfluidic devices is the enclosing of microchannels by cover plate, i.e., layer to layer bonding. This investigation focused on the thermal bonding of PMMA layers of different molecular weights. The bond strength and the effect of temperature and pressure on bond strength between various PMMA pairs of different molecular weights were studied. Thermal bonding was realized using a hot embossing system. PMMA strips made from predefined parameters were prepared and a customized CNC machine mold was used to determine the optimized parameters of the thermal bonding. The PMMA pairs investigated are of molecular weights 96.7, 120, 350 and 996 kDa using Instron machine; the shear strength of the thermally bonded specimens was determined. For the PMMA pairs investigated, the greatest shear strength of 1.589 ± 0.286 MPa was observed between molecular weights of 350 and 996 kDa.

Keywords

Shear Strength PMMA Bond Strength PDMS Microfluidic Device 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. Boone TD, Fan ZH, Hooper HH, Ricco AJ, Tan H, Williams SJ (2002) Plastics advances microfluidic devices. Anal Chem 74:78A–86A. doi: 10.1021/ac021943c CrossRefGoogle Scholar
  2. Fiorini GS, Jeffries GDM (2003) Fabrication of thermoset polyester microfluidic devices and embossing masters using rapid prototyped polydimethylsiloxane molds. Lab Chip 3:158–163CrossRefGoogle Scholar
  3. Han A, Wang O, Graff M (2003) Multilayer plastic/glass microfluidic systems containing electrical and mechanical functionality. Lab Chip 3:150–157CrossRefGoogle Scholar
  4. Jud K, Kaush HH, Willams JG (1981) Fracture mechanics studies of crack healing and welding of polymers. J Mater Sci 16:204–210. doi: 0022-2461/81/010204-07$02.70/0 CrossRefGoogle Scholar
  5. Kajiyama T, Tanaka K, Takahara A (1995) Depth dependence of the surface glass transition temperature of a poly(styrene-block-methyl methacrylate) diblock copolymer film on the basis of temperature dependent X-ray photoelectron spectroscopy. Macromolecule 28:3482–3484. doi: 10.1021/ma00113a059 CrossRefGoogle Scholar
  6. Kelly RT, Woolley AT (2003) Thermal bonding of polymeric capillary electrophoresis microdevices in water. Anal Chem 75:1941–1945. doi: 10.1021/ac0262964 CrossRefGoogle Scholar
  7. Kline DB, Wool RP (1988) Polymer welding relations investigated by a lap shear joint method. Poly Eng Sci 28:52–57. doi: 10.1002/pen.760280109 CrossRefGoogle Scholar
  8. Lee HS, Kim DS, Kwon TH (2003) A novel low temperature bonding technique for plastic substrates using X-ray irradiation. In. Digest. Tech papers transducers 03 conference, Boston, 8–12 June, pp 1331–1334. ISBN: 0-7803-7731-1, INSPEC accession number: 7913799Google Scholar
  9. Mayes AM (1994) Glass transition of amorphous polymer surfaces. Macromolecule 27:3114–3115. doi: 10.1021/ma00089a033 CrossRefGoogle Scholar
  10. McDonald JC, Dufy DC, Anderson JR, Chiu DT, Wu H, Schueller OJA, Whiteside GM (2000) Fabrication of the microfluidic systems in poly(dimethyl-siloxane). Electrophoresis 21:27–40. doi: 10.1002/(SICI)1522-2683(20000101)21:1<27:AID-ELPS27>3.0.CO;2-C CrossRefGoogle Scholar
  11. Robert MA, Rossier JS, Bercier P, Giurault HH (1997) UV laser machined polymer substrates for the development of microdiagnostics systems. Anal Chem 69:2035–2042. doi: 10.1021/ac961038q CrossRefGoogle Scholar
  12. Soper SA, Ford SM, Qi S, McCarley RL, Kelly K, Murphy MC (2000) Micro-electromechanical systems fabricated in polymeric materials: applications in chemistry and life sciences. Anal Chem 72:643A–651ACrossRefGoogle Scholar
  13. Zhu X, Liu G, Tian Y (2004) A new method of layer-to layer bonding of PMMA. In: Proceedings of the 4th international workshop on microfactories (IWMF), Shanghai, 15–17 OctoberGoogle Scholar
  14. Zhu X, Liu G, Guo Y, Tian Y (2007) Study of PMMA thermal bonding. Microsyst Technol 13:403–407. doi: 10.1007/s00542-006-0224-x CrossRefGoogle Scholar

Copyright information

© Springer-Verlag 2009

Authors and Affiliations

  • Nimai C. Nayak
    • 1
    • 3
    Email author
  • C. Y. Yue
    • 1
    • 2
  • Y. C. Lam
    • 1
    • 2
  • Y. L. Tan
    • 2
  1. 1.Singapore-MIT Alliance, Manufacturing Systems & Technology ProgrammeNanyang Technological UniversitySingaporeSingapore
  2. 2.School of Mechanical and Aerospace EngineeringNanyang Technological UniversitySingaporeSingapore
  3. 3.Department of Chemistry, Institute of Technical Education & ResearchSOA UniversityBhubaneswarIndia

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