Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining
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This paper reports on the fabrication of high aspect ratio silicon microelectrode arrays by micro-wire electrical discharge machining (μ-WEDM). Arrays with 144 electrodes on a 400 μm pitch were machined on 6 and 10 mm thick p-type silicon wafers to a length of 5 and 9 mm, respectively. Machining parameters such as voltage and capacitance were varied for different wire types to maximize the machining rate and to obtain uniform electrodes. Finite element analysis was performed to investigate electrode shapes with reduced lateral rigidity. These compliant geometries were machined using μ-WEDM followed by a two step chemical etching process to remove the recast layer and to reduce the cross sections of the electrodes.
KeywordsElectrical Discharge Machine Work Piece Electrode Array Wire Electrical Discharge Machine Machine Characteristic
This material is based upon work supported by ProfX2 fellowship grant awarded to Prashant Tathireddy by Fraunhofer Gesellschaft, Germany and equipment developed with support from Optimation, LLC and the National Science Foundation under Grant No. 0512897.
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