Microsystem Technologies

, Volume 14, Issue 9–11, pp 1405–1409 | Cite as

Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

  • Xuechuan Shan
  • H. P. Maw
  • R. T. Tjeung
  • S. H. Ling
  • C. W. Lu
  • R. Jachowicz
Technical Paper
First Online:
Received:
Accepted:

Abstract

Microstructures were formed on low temperature co-fired ceramic (LTCC) green substrates with high fidelity using micro embossing. The impact of embossing temperature and pattern density against the embossed profiles was investigated. The increase in pattern density resulted in a macro deformation in addition to embossed micro-depth. The macro deformation can be decreased by careful management of pattern density as well as pressure ramp and temperature ramp. The embossed ceramic green substrates were debinded and co-fired with a supplier-recommended process; the dimension shrinkage of embossed channels after co-firing ranges from 20 to 22% in depth and from 10 to 13% in width. The achievements of this investigation demonstrated that micro embossing is a promising process for fabricating ceramic-based microstructures and devices, including embedded cavities and channels.

Keywords

Thermo Gravimetric Analysis Organic Additive Pattern Density Green Substrate Green Tape 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
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Notes

Acknowledgments

The authors would like to express acknowledgments to Mr. Chua KM and Ms. Liu YC of SIMTech for their helpful discussion and cooperation. This work is supported by Agency for Science, Technology and Research (A*STAR) of Singapore for Singapore–Poland Cooperation.

References

  1. Andrijasevic D, Smetana W, Zehetner J, Zoppel S, Brenner W (2007) Aspects of micro structuring low temperature cofired ceramic for realization complex 3D objects by embossing. Microelectr Eng 84:1198–1201CrossRefGoogle Scholar
  2. Bogdanski N, Schulz H, Wissen M, Scheer HC, Zajadacz J, Zimmer K (2004) 3D hot embossing of undercut structures. Microelectr Eng 73:190–195CrossRefGoogle Scholar
  3. Chua KM, Lu CW, Jin L, Fan W and Wong CK (2004) Realization of LTCC modules for broadband applications. In: Proceedings of 6th electronics packaging technology conference-EPTC 2004, Singapore: pp 235–238Google Scholar
  4. De Torres BH (2007) Embossing of microfluidic structures in ceramic multilayers. In: smart systems integration 2007. Gessner (Editor) Paris: pp 423–425, ISBN 978-3-8007-3009-4Google Scholar
  5. Golonka LJ (2005) New application of LTCC technology. In: IEEE proceedings of 28th international seminar on electronics technology, Austria: pp 162–166Google Scholar
  6. Gongora MR et al (2001) Overview of low temperature co-fired ceramics tape technology for meso-system technology. Sens Actuators A 89:222–241CrossRefGoogle Scholar
  7. Rabe T, Kuchenbecker P, Schulz B, Schmidt M (2007) Hot embossing-an alternative method to produce cavities in ceramic multilayer. Int J Appl Ceramic Technol 4:38–46CrossRefGoogle Scholar
  8. Wang G, Fork C, Barlow F, Elshabini A (2006) Fabrication of microvias for multilayer LTCC substrates. IEEE Trans electron packaging manuf 29:32–41CrossRefGoogle Scholar

Copyright information

© Springer-Verlag 2008

Authors and Affiliations

  • Xuechuan Shan
    • 1
  • H. P. Maw
    • 1
  • R. T. Tjeung
    • 1
  • S. H. Ling
    • 1
  • C. W. Lu
    • 1
  • R. Jachowicz
    • 2
  1. 1.Singapore Institute of Manufacturing Technology (SIMTech)SingaporeSingapore
  2. 2.Institute of Electronic SystemsWarsaw University of TechnologyWarszawaPoland

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