Microsystem Technologies

, Volume 13, Issue 3–4, pp 343–347 | Cite as

Fabrication of RF MEMS variable capacitors by deep X-ray lithography and electroplating

  • Sven Achenbach
  • David Klymyshyn
  • Darcy Haluzan
  • Timo Mappes
  • Garth Wells
  • Jürgen Mohr
Technical Paper

Abstract

Radio frequency micro electro-mechanical systems (RF MEMS) vertical cantilever variable capacitors fabricated using deep X-ray lithography and electroplating are presented. Polymethylmethacrylate (PMMA) layers of 100 μm and 150 μm have been patterned and electroplated with 70 μm and 100 μm thick nickel. A 3 μm thick titanium layer was used as plating base as well as etch time-controlled sacrificial layer for the release of the cantilever beam. The parallel plate layout includes narrow gaps and cantilever beams with an aspect ratio in nickel of up to 60 for 1 mm long features. Auxiliary structures support the beams and gaps during the processing. Room temperature electroplating significantly reduces the risk of deformations compared to the standard process temperature of 52°C. The capacitors operate in the 1–5 GHz range, and demonstrate good RF performance, with quality factors on the order of 170 at 1 GHz for a 1 pF capacitance.

Keywords

RF MEMS Variable capacitor X-ray lithography Electroplating 

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Copyright information

© Springer-Verlag 2006

Authors and Affiliations

  • Sven Achenbach
    • 1
    • 2
    • 3
  • David Klymyshyn
    • 2
    • 3
  • Darcy Haluzan
    • 2
    • 3
  • Timo Mappes
    • 1
  • Garth Wells
    • 3
  • Jürgen Mohr
    • 1
  1. 1.Forschungszentrum KarlsruheInstitut für Mikrostrukturtechnik (IMT)KarlsruheGermany
  2. 2.Department of Electrical EngineeringUniversity of SaskatchewanSaskatoonCanada
  3. 3.TRLabsSaskatoonCanada

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