A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces
Abstract
SU-8 has received wide attention in recent years because of its application in the fabrication of high aspect ratio microstructures and devices. This negative resist is known for its excellent lithography properties using ultraviolet light source. As the microfabrication technology based on UV-lithography of SU-8 finds wide applications, a good understanding and characterization of cured SU-8 polymer on various substrate materials are therefore very important. A good adhesion on various substrate materials is essential to both the fabrication process and to the functionality of any final products that have cured SU-8 as part of the structural material. There are very limited studies reported in this important area in the literature. This paper presents a theoretical and experimental work to quantitatively study the adhesion properties of cured SU-8 on some of the most commonly used metallic surface materials. The adhesion strengths of cured SU-8 samples on Au, Ti, Cu, Cr, and Ni coated glass substrates were measured following ASTM-C633 standard. A detailed analysis of the experimental results was also provided based on the atomic structures and electron configurations of the respective metals.
Keywords
Adhesion Strength Metallic Surface Coated Substrate Aluminum Cylinder Separation LoadNotes
Acknowledgement
This work is supported in whole or in part by the National Science Foundation under Grant Number EPS-0346411 and the State of Louisiana Board of Regents Support Fund.
References
- ASTM C633 (1993) Standard test method for adhesion or cohesive strength of flame-sprayed coatings. American Society for Testing and Materials, Philadelphia, PA, USAGoogle Scholar
- Bhushan B (2003) Adhesion and stiction: mechanisms, measurement techniques, and methods for reduction. J Vac Sci Technol B 21(6)Google Scholar
- Buch A (1999) Pure metals properties—a scientific technical handbook. ASM International and Freund Publishing House, LTD, ISBN 0-87170-637-7Google Scholar
- Conradie EH, Moore DF (2002) SU-8 thick photoresist processing as a functional material for MEMS applications. J Micromech Microeng 12:368–374CrossRefGoogle Scholar
- Curtis P, Iezekiel S, Miles RE, Pescod CR (2001) SU-8 as a material for integrated all-optical microwave filters. Microw Eng, pp 51–54Google Scholar
- Dai W, Oropeza C, Lian K, Wang W (2005) Experiment design and UV-LIGA microfabrication technology to study the fracture toughness of Ni microstructures. Microsyst Technol (in press)Google Scholar
- Derjaguin BV, Krotova NA, Smilga VP (1978) Adhesion of solids (translated from Russian by RK Johnston)(consultants Bureau, New York)Google Scholar
- Jeong SJ, Wang W (2004) Microaccelerometers using cured SU-8 as structural material. In: Proceedings of SPIE symposium on micromachining and microfabrication, photonics west, mems/moems components and their applications, proceedings of SPIE, vol 5344. January 24–29, 2004. San Jose, CA, USAGoogle Scholar
- Jingquan L, Bingchu C, Jun Z et al (2001) Fabrications of high-aspect ratio microstructure on metallic substrate using SU-8 resist, micromaching and microfabrication process technology and devices, Proc SPIE 4601:200–204Google Scholar
- Jun Z, Xiaolin Z, Zhiping N (2000) High aspect ratio microstructure fabrication using SU-8 resist, micromaching and microfabrication process technology and devices. Proc SPIE 4174Google Scholar
- Khoo HS, Liu K-K, Tseng F-G (2003) Mechanical strength and interfacial failure analysis of cantilevered SU-8 microposts. J Micromech Microeng 13:822–831CrossRefGoogle Scholar
- Konaka Y, Allen MG (1996) Single and multi-layer electroplated microaccelerometers. In: Proceedings of the IEEE micro electro mechanical systems (MEMS), pp 168–173Google Scholar
- LaBianca N, Delorme J (1995) High aspect ratio resist for thick film applications. Proc SPIE 2438:846–852CrossRefGoogle Scholar
- Lee K, LaBianca N, Rishton S, Zohlgharnain S (1995) Micromachining applications for a high resolution ultra-thick photoresist. J Vac Sci Technol B 13:3012–3016CrossRefGoogle Scholar
- Lee DE, Chen H-P, Soper S, Wang W (2003) An electrochemical micropump and its application in a DNA mixing and analysis system, presented in Micromachining and microfabrication, Photonics West, January 2003. San Jose, CA, USAGoogle Scholar
- Ling ZG, Lian K, Jian L (2000) Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters. Proc SPIE 3999:1019–1127CrossRefGoogle Scholar
- Lorenz H, Despont M, Fahrni N, Labianca N, Vettiger P, Renaud P (1996) EPON SU-8: a low-cost negative resist for MEMS. In: Proceedings of the micro mechanics Europe’96, Barcelona, pp 32–35Google Scholar
- Lorenz H, Despont M, Vettiger P, Renaud P (1998a) Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist. Microsyst Technol 4:143–146CrossRefGoogle Scholar
- Lorenz H, Laudon M, Renaud P (1998b) Mechanical characterization of a new high-aspect-ratio near UV-photoresist. Microelec Eng 41(42):371–374CrossRefGoogle Scholar
- Lorenz H, Despont M, Fahrni N, Brugger J, Renaud P, Vettiger P (1998c) High aspect ratio ultrathick, negative-tone near-UV photoresist and its applications for MEMS. Sens Act A A64:33–39CrossRefGoogle Scholar
- Miessler GL, Tarr DA (1991) Inorganic chemistry. Prentice-Hall, Englewood cliffs, NJ 07632, ISBN 0-13-465659-8Google Scholar
- Thorpe J, Steenson D, Miles R (1998) High frequency transmission line using micromachined polymer dielectric. Electron Lett 34:1237–1238 (using SU-8 as insulation dielectric for mm-wave transmission line in copper between 20 GHz and 40 GHz)CrossRefGoogle Scholar
- Williams JD, Wang W (2004a) Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography. Microsyst Technol 10(10): 694–698CrossRefGoogle Scholar
- Williams JD, Wang W (2004b) Study on the postbaking process and the effects on ultraviolet lithography of high aspect ratio SU-8 microstructures. J Microlithogr Microfab Microsyst 3(4):563–568CrossRefGoogle Scholar
- Yang R, Jeong SJ, Wang W (2003) UV-LIGA microfabrication of a power relay based on electrostatic actuation, presented in Micromachining and microfabrication, Photonics West, January 2003. San Jose, CA, USAGoogle Scholar