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Microsystem Technologies

, Volume 10, Issue 6–7, pp 544–546 | Cite as

SOI wafer mold with high-aspect-ratio microstructures for hot embossing process

  • Y. Zhao
  • T. Cui
Article

Abstract

This paper reports using a Silicon oil insulator (SOI) wafer as a mold insert for the hot embossing process on high-aspect-ratio microstructures to overcome two drawbacks of Inductive Coupled Etching (ICP) process, the area dependent etching and the micrograss. A thin sacrificial wall to eliminate the undercut in the big open area during ICP etching is also described. A good result of final embossed structure on PMMA with aspect ratio of 12 : 1, uniform thickness, and smooth surface is presented.

Keywords

Silicon Microstructure Mold Aspect Ratio PMMA 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2004

Authors and Affiliations

  1. 1.Institute for MicromanufacturingLouisiana Tech UniversityRustonUSA

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