Microsystem Technologies

, Volume 10, Issue 4, pp 265–268

Process research of high aspect ratio microstructure using SU-8 resist

  • J. Liu
  • B. Cai
  • J. Zhu
  • G. Ding
  • X. Zhao
  • C. Yang
  • D. Chen
Article

DOI: 10.1007/s00542-002-0242-2

Cite this article as:
Liu, J., Cai, B., Zhu, J. et al. Microsystem Technologies (2004) 10: 265. doi:10.1007/s00542-002-0242-2

Abstract

SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications.

Keywords

UV-LIGA SU-8 resist Orthogonal array experiments High aspect ratio 

Copyright information

© Springer-Verlag Berlin Heidelberg 2004

Authors and Affiliations

  • J. Liu
    • 1
  • B. Cai
    • 1
  • J. Zhu
    • 1
  • G. Ding
    • 1
  • X. Zhao
    • 1
  • C. Yang
    • 1
  • D. Chen
    • 1
  1. 1.The State Laboratory of Micro/Nanometer Fabrication TechnologyInformation Storage Research CenterShanghaiPR China

Personalised recommendations