Microsystem Technologies

, Volume 8, Issue 1, pp 3–6

Recent developments in dimensional metrology for microsystem components

  • S. Cao
  • U. Brand
  • T. Kleine-Besten
  • W. Hoffmann
  • H. Schwenke
  • S. Bütefisch
  • S. Büttgenbach

Abstract

 The PTB currently develops a special coordinate measuring machine (μCMM) for three-dimensional metrology on microsystem components. This μCMM is aimed at a measurement uncertainty of 3D-coordinates of <0.1 μm for microstructures. The instrument contains an opto-tactile sensor and a new tactile 3D-micro-sensing system. The 3D-micro probe is based on a silicon boss-membrane with piezo resistive transducers which allow measuring deflections of the probe pin and simultaneously forces in three dimensions. First 2D-probing experiments with a stiff commercial stylus, 15 mm long, with a 300 μm ruby ball have been carried out showing its resolution and repeatability.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer-Verlag Berlin Heidelberg 2002

Authors and Affiliations

  • S. Cao
    • 1
  • U. Brand
    • 1
  • T. Kleine-Besten
    • 1
  • W. Hoffmann
    • 1
  • H. Schwenke
    • 1
  • S. Bütefisch
    • 2
  • S. Büttgenbach
    • 2
  1. 1.Physikalisch-Technische Bundesanstalt, Bundesallee 100, D-38116 Braunschweig, Germany E-mail: uwe.brand@ptb.deDE
  2. 2.Institute for Microtechnology, Technical University of Braunschweig, Germany E-mail: S.Buetefisch@tu-bs.deDE

Personalised recommendations