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A convected-particle tetrahedron interpolation technique in the material-point method for the mesoscale modeling of ceramics

  • R. B. LeavyEmail author
  • J. E. Guilkey
  • B. R. Phung
  • A. D. Spear
  • R. M. Brannon
Original Paper
  • 43 Downloads

Abstract

Convected particle domain interpolation, which is known to boost the accuracy of the material-point method, is applied in a form called convected-particle tetrahedron interpolation (CPTI). CPTI exploits the efficiency of tetrahedral tessellations to represent complex structural geometries, while still solving field equations on a rectilinear background grid. Advantages include anti-locking and an ability to handle extremely large deformations without suffering typical Eulerian advection errors. CPTI is demonstrated to resolve long-standing errors caused by spuriously ragged (stair-stepped) surfaces, and it is also shown to accommodate mathematically rigorous evaluation of surface integrals in models for contact and friction. Benefits of this work are illustrated in mesoscale simulations of an aluminum oxynitride ceramic.

Keywords

Material point method Convected particle domain interpolation Ceramics Crystal plasticity Aluminum oxynitride Verification 

Notes

Acknowledgements

The authors acknowledge the early CPDI contributions of Ali Sadeghirad at the University of Utah. John Clayton, Rich Becker and Jeff Lloyd of the Army Research Lab (ARL) are acknowledged for assistance in mesoscale modeling and crystal-plasticity guidelines in traditional finite elements. Brian Schuster, Tomoko Sano and Sikhanda Satapathy assisted in the aluminum oxynitride characterization. The HEDM analysis and reconstruction of AlON, which informed the simulations was conducted under cooperative agreement W911NF-12-2-0065 by C.M. Hefferan, J. Lind, S. Madalli, and R.M. Suter. Additional support was supplied by the University of Utah’s CHPC, Schlumberger, Inc., the Office of Naval Research (ONR-MURI), Sandia National Laboratories, ARL student support and High Performance Computing (HPC) resources.

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Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2019

Authors and Affiliations

  1. 1.Mechanical EngineeringUniversity of UtahSalt Lake CityUSA
  2. 2.Impact Physics BranchArmy Research LabAberdeen Proving GroundUSA

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