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Applied Physics B

, Volume 107, Issue 4, pp 935–943 | Cite as

Thick-film technology for ultra high vacuum interfaces of micro-structured traps

  • D. Kaufmann
  • T. Collath
  • M. T. Baig
  • P. Kaufmann
  • E. Asenwar
  • M. Johanning
  • C. WunderlichEmail author
Article

Abstract

We adopt thick-film technology to produce ultra high vacuum compatible interfaces for electrical signals. These interfaces permit voltages of hundreds of volts and currents of several amperes and allow for very compact vacuum setups, useful in quantum optics in general, and in particular for quantum information science using miniaturized traps for ions (Kielpinski et al. in Nature 417:709, 2002) or neutral atoms (Folman et al. in Phys. Rev. Lett. 84:4749, 2000; Treutlein et al. in Fortschr. Phys. 54:702, 2006; Hofferberth et al. in Nat. Phys. 2:710, 2006). Such printed circuits can also be useful as pure in-vacuum devices. We demonstrate a specific interface which provides 11 current feedthroughs, more than 70 dc feedthroughs and a feedthrough for radio frequencies. We achieve a pressure in the low 10-11 mbar range and demonstrate the full functionality of the interface by trapping chains of cold ytterbium ions, which requires the presence of all of the above mentioned signals. In order to supply precise time-dependent voltages to the ion trap, a versatile multi-channel device has been developed.

Keywords

Print Circuit Board Ytterbium Magnetic Field Gradient Ultra High Vacuum Vacuum Interface 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

We gratefully acknowledge our electrical and mechanical work shops, and especially D. Gebauer who accomplished the thick-film printing for our chip carrier. We thank Andrés F. Varón for fruitful discussions. We acknowledge financial support by the European Union (STREP Microtrap and PICC), by the Deutsche Forschungsgemeinschaft and by secunet AG.

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Copyright information

© Springer-Verlag 2012

Authors and Affiliations

  • D. Kaufmann
    • 1
  • T. Collath
    • 1
  • M. T. Baig
    • 1
  • P. Kaufmann
    • 1
  • E. Asenwar
    • 1
  • M. Johanning
    • 1
  • C. Wunderlich
    • 1
    Email author
  1. 1.Department of Physics, Faculty IV: Science and TechnologyUniversity of SiegenSiegenGermany

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