Interfacial microstructure and reaction at the spin-coated fluorinated polyimide/Al interface: surface-enhanced X-ray diffraction and TEM studies

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multilayers by means of X-ray diffraction, transmission electron microscopy, and an ellipsometer. The FPI precursor, a solution of PMDA/6FDA/TFMOB/PPD was spin-coated onto the Al layer and then cured at 400 °C for one hour. It is found that the moisture and oxygen from the FPI layer released during thermal treatment can lead to the oxidation of the interface between the Al and the FPI. The TEM cross-sectional images and the electron diffraction patterns indicate that the oxidized interface is amorphous. The oxidation product is identified to be Al₂O₃. The oxidation onset temperature is determined to be 415 °C, which is slightly higher than the curing temperature. The oxidation of the FPI/Al interface results in an increase in the electrical resistance of the Al layer, and thus may lead to a reduction in its effective electrical thickness.