High-precision micro-through-hole array in quartz glass machined by infrared picosecond laser
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Circle and triangle micro-through-hole arrays without cracks, chips, and debris were machined in 0.3-mm-thick quartz glass by picosecond laser (wavelength = 1064 nm, pulse width ~12 ps) in air ambient. The diameter of each circle through-hole was 550 μm, and the side length of each triangle hole is 500 μm; 30 μm spacing between the adjacent hole edges and the smooth machined surface with R a = 0.8 μm roughness depicted the high precision of the high-density micro-through-hole arrays. The fundamental properties of the ps laser processing of quartz glass were investigated. The laser ablation threshold fluence of the quartz glass was determined as 3.49 J/cm2. Based on the fundamental investigation, a quantitative design of the cutting path for micro-machining of the through-holes with various geometries in quartz glass was developed. The work presents a more practical ps laser micro-machining technique for micro-through-hole arrays in glass-like materials for industrial application due to the precise quality, flexibility in geometries, ease of manipulation, and large-scale application.
KeywordsQuartz Glass Groove Depth Exit Side Scanning Path Circular Groove
This work is supported by National Science Foundation of China (51275011) and New Century Excellent Talents in University (NCET-10-0007). Acknowledgment is also made to Scientific Research Program of Beijing Municipal Commission of Education (KZ20131005005).
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