Analysis of eco-relevant elements and noble metals in printed wiring boards using AAS, ICP–AES and EDXRF
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Different analytical procedures were developed to investigate the chemical composition of printed wiring boards. A set of 11 samples from different electronic devices were ground and prepared for ICP–AES and AAS analyses by extraction with aqua regia and microwave digestion. Several sample preparation techniques were used for the analyses by EDXRF; the best results were obtained by embedding the samples in Vaseline. Since no standard reference material is available for printed wiring boards, a model reference material was created to compare the applicability and limitations of the employed analytical techniques.