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Effect of filling level and fillet profile on pin-through-hole solder joint

  • M. H. H. Ishak
  • M. S. Abdul AzizEmail author
  • Farzad Ismail
  • C. Y. Khor
  • M. Z. Abdullah
  • Aizat Abas
ORIGINAL ARTICLE
  • 12 Downloads

Abstract

This study investigates the effects of filling level and fillet profile on a solder joint strength between pin-through hole (PTH) and a printed circuit board. The influences of filling level and fillet profile on deformation, von Mises stress and strain are the focus of this research. Five filling levels (20%, 40%, 60%, 80% and 100%) and fillet profiles (0.2, 0.4, 0.6, 0.8 and 1.0) are considered. The Abaqus software is used to examine the PTH structure. A tension test experiment is conducted on a single PTH connector, and its results are compared with the simulation results. The simulation and experimental results show an almost identical linear trend with an average discrepancy of 3.39%. Results show that an increase in the filling level and the fillet profile increases the structural deformation/displacement and the von Mises stress. The displacement and the von Mises stress of the PTH exhibit a linear correlation with the filling level and the fillet profile. This study is expected to provide a good understanding of solder joint strength during wave soldering.

Keywords

Pin-through hole Solder joint Wave soldering 

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Notes

Funding

The authors would like to extend their appreciation to Universiti Sains Malaysia (Research University Grant (RUI) 1001/PMEKANIK/ 8014072) for providing the financial and technical support for this research.

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Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  1. 1.School of Aerospace EngineeringUniversiti Sains Malaysia, Engineering CampusNibong TebalMalaysia
  2. 2.School of Mechanical EngineeringUniversiti Sains Malaysia, Engineering CampusNibong TebalMalaysia
  3. 3.Faculty of Engineering TechnologyUniversiti Malaysia PerlisPadang BesarMalaysia

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