Relationship between subsurface damage depth and breaking strength for brittle materials
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Subsurface damages (SSD) induced by lapping strongly influence performances of optical components. However, to date, a wide variety of destructive and non-destructive techniques for measuring the SSD depth have been explored. In the present study, a novel destructive technique was proposed based on breaking strength of the lapped materials. The proposed technique relates the length of median cracks, formed through the Vickers indentation test, and the breaking strength of the indented samples. With this technique, subsurface damage depth can be practically evaluated via measuring breaking strength of lapped samples. The subsurface damage depth and surface roughness of ground and lapped BK7 glass were measured by the bonded interface sectioning technique and contacting profilometer, respectively. In order to validate the feasibility of the proposed technique, the values of SSD depth obtained by the calibration curve were compared with the values of SSD depth measured by the bonded interface sectioning technique. The obtained results are in concordance in the both used methods, which prove the efficiency of our technique to estimate the SSD depth of brittle materials.
KeywordsSubsurface damage Surface roughness Lapping Brittle materials Breaking strength
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- 6.Camp DW, Kozlowski MR, Sheehan LM, Nichols MA, Dovik M, Raether RG, Thomas IM Subsurface damage and polishing compound affect the 355-nm laser damage threshold of fused silica surfaces. In: Laser-induced damage in optical materials: 1997, 1998. SPIE, p 9Google Scholar
- 20.Arrasmith SR, Jacobs SD, Lambropoulos JC, Maltsev A, Golini D, Kordonski WI (2001) Use of magnetorheological finishing (MRF) to relieve residual stress and subsurface damage on lapped semiconductor silicon wafers. In: International Symposium on Optical Science and Technology. SPIE, p 9Google Scholar
- 22.Zhou Y, Funkenbusch PD, Quesnel DJ, Golini D, Lindquist A (1994) Effect of etching and imaging mode on the measurement of subsurface damage in microground optical glasses. J Am Ceram Soc 77(12):3277–3280. https://doi.org/10.1111/j.1151-2916.1994.tb04585.x CrossRefGoogle Scholar
- 29.Lawn BR, Evans AG (1980) Elastic/plastic indentation damage in ceramics: the median/radial crack system. J Am Ceram Soc 63(9–10):481–600Google Scholar
- 32.Aleinikov FK (1957) The effect of certain physical and mechanical properties on the grinding of brittle materials. Phys Tech Phys 27:2529–2538Google Scholar