Phase and stress evolution in diamond microparticles during diamond-coated wire sawing of Si ingots
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Diamond microparticles undergo changes to their structure and stress state during diamond-coated wire sawing of Si ingots. This phenomenon is revealed using confocal, micro-Raman spectroscopy of diamond microparticles attached to wires which perform the sawing action. Post-wafer-sawed diamonds show the appearance of D (1350 cm−1) and G (1597 cm−1) bands of graphite besides the characteristic diamond T2g band at 1332 cm−1. The graphitic phase extends inside the diamond to a depth of ~ 14 μm. The ratio of the intensities of D and G bands allows an estimate of the graphitic crystallite size. The grain size varies from 10 nm close to the surface to 53 nm near the graphite/diamond interface. On other diamonds, blue shifts in the T2g peak position are observed indicating the presence of compressive stress. The peak shifts (up to 3.6 cm−1) are anisotropic, i.e., along the direction of wire cutting, and are estimated to be 2.9 GPa. It is proposed that the cumulative effect of compressive stresses over multiple cutting events during the sawing process can lead to local graphitization of diamond particles, thus contributing to loss in cutting efficiency.
KeywordsDiamond Graphitization Diamond-coated wire sawing Raman spectroscopy
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- 1.Bye J, Norheim L, Holme B, Nielsen O, Steinsvik S, Jensen S, Fragiacomo G, Lombardi I (2011) Industrialised diamond wire wafer slicing for high efficiency solar cells. In: Proceedings of the 26th European photovoltaic solar energy conference, WIP-Renewable Energies, Germany, pp 956–960Google Scholar
- 11.Sopori B, Devayajanam S, Shet S, Guhabiswas D, Basnyat P, Moutinho H, Gedvilas L, Jones K, Binns J, Appel J (2013) Characterizing damage on Si wafer surfaces cut by slurry and diamond wire sawing. Paper presented at the 2013 I.E. 39th photovoltaic specialists conference. IEEE, New York. 10.1109/pvsc.2013.6744298
- 12.Holt A, Thogersen A, Rohr C, Bye J, Helgesen G, Nordseth O, Jensen SA, Norheim L, Nielsen O (2010) Surface structure of mono-crystalline silicon wafers produced by diamond wire sawing and by standard slurry sawing before and after etching in alkaline solutions. Paper presented at the 2010 35th IEEE photovoltaic specialists conference (PVSC). IEEE, New York. 10.1109/PVSC.2010.5614103
- 14.Lewis IR, Edwards HGM (2001) Handbook of Raman spectroscopy: from the research laboratory to the process line. Practical spectroscopy, vol 28. Marcel Dekker, New YorkGoogle Scholar
- 15.Zhang Y, Tani Y, Murata J, Hashizume T (2014) Development of partially Ni-coated diamond abrasives for electroplated tools. Trans JSME 80:SMM0111. doi: 10.1299/transjsme.2014smm0111